Industry News | 2015-11-14 13:59:43.0
Juki Automation Systems announce that the companies were awarded a joint 2015 Editor’s Choice Award from Global SMT & Packaging magazine for the new ISM UltraFlex 3600. The award was presented to the companies during a Tuesday, Nov. 10, 2015 ceremony that took place at the Messe München exhibition center in Munich, Germany during Productronica. The ISM UltraFlex 3600 adds a tier on top of the current lineup offered by Storage Solutions and Juki.
Industry News | 2011-09-23 22:09:26.0
Nordson DAGE announces that a Technical Paper entitled "The Last Will and Testament of the BGA Void" will be presented at the SMTA International Conference & Exhibition.
Industry News | 2022-05-04 20:38:03.0
The combination solidifies Summit's position as one of the largest privately owned printed circuit board (PCB) manufacturers in North America with a footprint that will now encompass eight manufacturing facilities. The acquisition significantly broadens the scope of Summit's product offering while expanding the company's business portfolio of key customers and end-markets.
Industry News | 2017-11-08 07:18:03.0
XJTAG, a world leading supplier of boundary scan technology and Systech Europe, a leading European provider of electronic test solutions, today announced the availability of an integrated solution using XJTAG boundary scan and Takaya’s flying probe system.
Industry News | 2019-06-02 18:40:27.0
SHENMAO America, Inc. introduces SMF-WC53 Water Soluble Ball-Attach Flux and Solder Sphere for use in ball-attach processes. With excellent solderability and high reliability, SHENMAO’s solder sphere can be used in a wide range of solder applications with various sizes from 50-760 μm.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2023-11-13 12:31:47.0
Circuit Technology Center announces it has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. They can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package requirements.
Industry News | 2016-11-01 10:59:19.0
PNC Inc. would like to invite you to come visit us at the Inaugural New England Exposition and Technical Forum at the DCU Center on November 3 in booth 100.
Industry News | 2017-11-08 15:24:31.0
Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.
Industry News | 2010-09-27 23:15:26.0
VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
