Industry News: flip chip bonder finetech (Page 1 of 9)

Baja Bid Online Auction – June 3-5, 2014 (Featuring Items From OneChip Photonics)

Industry News | 2014-05-22 15:42:29.0

Baja Bid announces their next online auction. This event includes assets from OneChip Photonics in Kanata, Ontario Canada.

Baja Bid

OneChip Photonics Facility In Canada Closing – All Assets Being Sold

Industry News | 2014-06-03 13:04:15.0

The OneChip Photonics facility in Kanata; Ontario, Canada will be closing their site and all assets are being sold via an online auction. The bidding for the auction will open promptly at 4:00am EST on June 3, 2014 with Lots 1-512 beginning to close at 11am EST on June 4, 2014.

Baja Bid

Finetech Shows Support for University Research

Industry News | 2012-02-07 16:16:09.0

Finetech will donate a high-accuracy die bonder in a drawing this summer that is open to U.S. and Canadian qualified universities and colleges. The multi-application FINEPLACER® Pico MA bonder with 5 micron placement accuracy is valued at $100,000.

Finetech

FINETECH to Exhibit at ECTC 2010

Industry News | 2010-05-24 23:09:12.0

FINETECH will exhibit in booth 403 at the Technology Corner of the Electronic Components and Technology Conference (ECTC), scheduled to take place June 2-3, 2010 at the Paris Las Vegas Hotel in Las Vegas.

Finetech

FINETECH Appoints Axiomatek as Exclusive Representative in Mexico

Industry News | 2009-01-13 19:26:03.0

FINETECH, a provider of innovative equipment solutions for advanced rework and packaging and assembly applications, announces that Axiomatek will assume sales responsibility for the company's product line in Mexico. Axiomatek is headquartered in Santa Teresa, New Mexico and has multiple offices in Mexico.

Finetech

Pennsylvania State University Wins Finetech Die Bonder Donation

Industry News | 2012-08-29 10:27:05.0

Pennsylvania State University was selected in a university donation drawing for a FINEPLACER® Pico MA bonder on August 15, 2012.

Finetech

High Accuracy Die Bonder on Display at IMAPS 2009

Industry News | 2009-10-16 19:21:16.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 515 at the upcoming IMAPS 2009 exhibition, scheduled for November 3-5, 2009, at the San Jose Convention Center in San Jose, Calif.

Finetech

High Accuracy Die Bonder on Display at SPIE Photonics West 2010

Industry News | 2010-01-07 20:09:26.0

FINETECH will showcase the +/- 0.5 micron placement accuracy FINEPLACER® Lambda in booth 1026 at the upcoming SPIE Photonics West exhibition, scheduled for January 23-28, 2010 at the Moscone Center in San Francisco, CA.

Finetech

Donated Finetech Die Bonder Installed at Pennsylvania State University

Industry News | 2013-03-11 09:10:32.0

A FINEPLACER® Pico bonder has been installed at the MEMS Nanoscale and Devices Group at Pennsylvania State University.

Finetech

FINETECH to Showcase Sub-Micron Bonder at SEMICON West 2010

Industry News | 2010-06-23 12:33:29.0

FINETECH will showcase the FINEPLACER® Lambda in booth 5570 at the upcoming SEMICON West exhibition, scheduled to take place July 13-15, 2010 at the Moscone Center in San Francisco.

Finetech

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