Industry News | 2012-07-12 10:34:27.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2012-07-12 10:34:54.0
The SMTA announced that it will have a Package-on-Package (PoP) Design and Assembly Center during their annual conference, SMTA International, taking place October 14-18, 2012 in Orlando, Florida.
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2022-11-11 07:33:41.0
Lyra Reflow Oven is a soft soldering that realizes the mechanical and electrical connection between the solder ends of surface mount components or the pins and the printed board pads by remelting the solder paste pre-distributed on the printed board pads.
Industry News | 2024-07-26 03:15:33.0
From 2023 to 2024, one piece of equipment has seen a remarkable surge in sales within I.C.T's extensive product lineup: the Selective Solder Machine. This unexpected rise in popularity has left many wondering, why this particular machine? Today, we embark on a journey to uncover the story behind the Selective Solder Machine's success. We'll explore its innovative features, the benefits it brings to electronics manufacturing, and the reasons why it has become the go-to choice for industry leaders. Join us as we dive deep into the compelling narrative of why the Selective Solder Machine is taking the market by storm.
Industry News | 2023-11-27 12:58:35.0
MacDermid Alpha Electronics Solutions introduces ALPHA® SF828-MBB. Designed for soldering small surface areas of wire and delivering excellent peel force and high machine cleanliness, this is MacDermid Alpha's latest liquid flux for the photovoltaic market.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2014-05-13 17:01:55.0
Indium Corporation's Graham Wilson, applications engineer, will present at Brasage in Brest, France on Friday, May 23. Wilson's presentation, Elimination of Head-in-Pillow in PoP Assembly: A Flux Approach, discusses eliminating head-in-pillow defects in the package-on-package (PoP) assembly process by engineering unique attributes of the flux chemistries of dipping fluxes and pastes.
Industry News | 2022-02-25 13:23:30.0
SHENMAO America, Inc. is pleased to offer its halogen-free SM-862 Liquid Flux that can replace the widely sold halogenated SM-816. The flux features low solid content and smooth flux residue, making it suitable for automatic wave soldering and manual dipping processes.
Industry News | 2016-10-09 21:27:24.0
SHENMAO Technology, Inc., the World’s Major Solder Materials Provider distributes from 10 worldwide locations, Semiconductor Packaging Solder Spheres, Package on Package Solder Paste, Bumping Solder Paste, Dipping Flux, SMT Solder Paste, Low and High Temperature Solder Paste, Solder Preform, Wave Solder Bar, Solder Wire and Flux, Liquid/Paste Flux and PV Ribbon.
