Industry News | 2020-01-06 16:00:05.0
KYZEN is pleased to announce that it will introduce a brand new, next-generation stencil cleaner at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. KYZEN® E5631 will be introduced for the first time in Booth #1637.
Industry News | 2014-10-23 15:20:42.0
MicroCare Corp. unveiled today the new and improved TidyPen® ‘60-second sticky stuff remover’. With thousands of the pocket-sized TidyPen® label removers sold monthly, the TidyPen® tool is a must-have time-saver for electronics manufacturing, repair shops, medical facilities, classrooms and any other place sticky labels are used.
Industry News | 2015-04-10 15:53:44.0
Blue Thunder Technologies will offer LOCTITE GC 10, named "The Game Changer"
Industry News | 2018-09-07 16:52:18.0
Kester is proud to announce the launch of WP616, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition.
Industry News | 2018-09-07 16:52:20.0
Kester is proud to announce the launch of WP616, a zero-halogen, lead-free, water-soluble solder paste formula for both nitrogen and air reflow applications. WP616 provides a combination of consistent print performance at wide humidity levels, excellent solderability and ease of cleaning, while maintaining a zero-halogen flux formulation. WP616 is a stable water-soluble formula, providing consistent stencil life, tack time and print definition.
Industry News | 2021-07-19 16:31:50.0
Indium Corporation has released TACFlux®571HF, a new no-clean, halogen-free flux formulated for both hand soldering and rework.
Industry News | 2016-10-09 21:32:22.0
Topic: Study on a Formulated No Clean Flux for Fine-Pitch Flip Chip Package of Copper Pillar/ Micro-bump Interconnect. Time: October 18, 10:00 am – 1:30 pm Authors: Hsiang-Chuan Chen, Ya-Ching Chuang, Chia-Hao Chang, Watson Tseng
Industry News | 2017-04-22 11:52:53.0
Engineered Material Systems is pleased to introduce the DF-4014 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.
Industry News | 2016-03-30 09:04:09.0
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
Industry News | 2008-01-16 14:12:28.0
LOS ALAMITOS, CA � January 15, 2008 � Practical Components, a leading international distributor of mechanical IC samples or �dummy� components and SMD production tools and equipment, announces that it will showcase its latest technology at the 2008 INTERNEPCON JAPAN exhibition to take place January 16-18 at the Tokyo Big Sight, Tokyo Japan. Practical will be displaying their products in booth No 14-14 with their Japanese Distributor, NISSHO MUSEN CO., LTD.
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