Industry News: fuji part data (Page 19 of 119)

Introducing the Fuji Flexible Placement Platform "AIMEX III"

Industry News | 2016-03-16 20:57:21.0

In regard to the placement processes used for electronic circuit boards, there are ever growing calls for high-mix, as well as variable-mix and variable-volume production in order to keep up with changes in the marketplace. In order to meet these demands, Fuji developed the flexible and expandable AIMEX IIIc, which was announced in October 2015. On this occasion we would like to announce the release of the AIMEX III, a machine built with the same concepts as the AIMEX IIIc, as well as the ability to produce large panels.

FUJI CORPORATION

Viscom AG adopts Valor Process Preparation solution for electronics manufacturing efficiency

Industry News | 2017-09-20 15:08:48.0

Viscom AG today announced the adoption of the Valor® Process Preparation technology from Mentor, a Siemens business, for its Viscom vVision SPI and AOI systems. Recognized globally for providing superior 3D optical and X-ray inspection systems for electronics manufacturing, Viscom is seeing important benefits in using this additional tool. When combined with Valor Process Preparation software, the efficiency of the machines is significantly enhanced.

Viscom AG

APEX 04: No Horizontal Turret Chip-Shooters

Industry News | 2004-02-27 09:43:23.0

At APEX 04' not placement machine manufacturer had a turret head chip-shooter in their booth.

Phoenix United Associates, Inc.

Valor and TraceXpert Complete on the Formation of

Industry News | 2004-03-02 09:52:56.0

Valor-Denmark immediately poised to deliver field-proven MES solutions

Valor Computerized Systems

Saki Self-Programming 3D Inspection Software is Fast, Easy, and Doesn't Require a Programmer

Industry News | 2018-08-14 17:57:21.0

Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.

SAKI America

Machine Vision Products demonstrates Dynamic Process Control (DPC) Line Manager and Fuji FLEXA Connectivity at Productronica 2009

Industry News | 2009-11-06 14:34:55.0

Machine Vision Products (MVP) today announced it would be demonstrating the award winning Dynamic Process Control (DPC) Manufacturing Management Suite at Productronica 2009 in Munich, November 10th to 13th. Hall A4 Booth 229.

Machine Vision Products, Inc

FUJI NP1L-FL3

Industry News | 2024-08-30 00:46:48.0

FUJI NP1L-FL3

Moore Automation LIMITED

FUJI SHARP Z-312J

Industry News | 2024-08-30 00:47:35.0

FUJI SHARP Z-312J

Moore Automation LIMITED

Surface mount technology equipment communication protocol standardization subcommittee’s launch

Industry News | 2017-11-14 18:40:51.0

At the Japan Robot Association, enterprises who manufacture surface mount technology (SMT) equipment and related software launched the SMT equipment communication protocol standardization subcommittee in order to establish protocols for sharing information by communication methods between SMT machines (M2M cooperation). A ballot was held, and the elected subcommittee chairman for the first year is from Fuji Machine Manufacturing Co., Ltd. and the vice subcommittee chairman is from Panasonic Corporation, with the board of governors comprising representatives from member corporations including Yamaha Motor Co., Ltd., JUKI CORPORATION, along with OMRON Corporation, Saki Corporation, TAMURA CORPORATION, and CKD Corporation. The twenty member companies shown in table 1 will work together to advance this standardization.

FUJI CORPORATION

NEPCON China 2011 to Highlight Trends in Intelligent Auto Electronics Manufacturing

Industry News | 2011-01-12 14:09:46.0

At the recently held Expo 2010 Shanghai, the 10-minute film “2030 Go!”, shown in the SAIC-GM Pavilion, showed intelligent technologies that included “car networking” and “unmanned car-driving” ― features of futuristic cars expected by the year 2030. Although vehicles that feature concepts like car networking are not yet popular in the mainstream, the application of electronic information technology in vehicles has long been standard.

Reed Exhibitions


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