Industry News | 2003-03-26 08:25:40.0
The QVE00033 transmissive switch's small size, surface mount package and performance make it ideal for noncontact switching applications in disk drives, card detectors, mise and trackballs.
Industry News | 2003-04-23 08:21:34.0
Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.
Industry News | 2003-04-15 08:57:18.0
First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies
Industry News | 2010-05-20 12:47:37.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.
Industry News | 2016-06-19 19:44:55.0
The SMTA and Chip Scale Review magazine are pleased to announce the Keynote Presenters for the 13th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.
Industry News | 2018-06-04 18:18:26.0
StratEdge Corporation will feature its new line of packages that meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices at the 2018 International Microwave Symposium. StratEdge packages meet the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.
Industry News | 2018-09-26 14:06:56.0
StratEdge Corporation will display its high-frequency, high-speed, thermally efficient packages at IMAPS, BCICTS, and EDI CON USA. StratEdge's packages meet the extreme demands of gallium nitride (GaN) and gallium arsenide (GaAs) devices and the critical requirements of the telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS markets.
Industry News | 2018-03-05 16:07:28.0
StratEdge Corporation announces that it will display its high-frequency and very high-power device packages in booth 62 at the IMAPS Device Conference. The conference is being held March 6 and 7th at WekoPa Resort and Casino in Fountain Hills, Arizona.
Industry News | 2018-08-22 20:04:37.0
StratEdge Corporation announces that DNV GL - Business Assurance has found StratEdge Corporation to conform to the Quality Management System standard ISO 9001:2015. The certificate is valid for the design and manufacture of semiconductor packages, filters, and electronic component assembly.
Industry News | 2020-01-15 15:19:33.0
StratEdge Corporation announces that Reginald (Regi) Nocom has joined StratEdge as a process engineer. With over 20 years in the microelectronics industry and extensive experience in implementing Six Sigma practices, Nocom is well-positioned to lead StratEdge in the development of new processes for manufacturing semiconductor packages and enhancing StratEdge's IC package assembly services.
