Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2012-01-07 21:49:07.0
As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
Industry News | 2021-01-19 13:51:42.0
New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation
Industry News | 2017-04-06 12:23:08.0
Laser Design, Inc., a subsidiary of CyberOptics® announced it will demonstrate its CyberGage®360, a metrology-grade, ultra-fast, one-button automated 3D scanning and inspection system at the Control show, May 9-12th in Stuttgart, Germany in booth #7236.
Industry News | 2017-03-07 19:57:28.0
CyberOptics® Corporation today announced that it will demonstrate the CyberGage®360, an automated 3D scanning inspection system, at Southern Manufacturing 2017 , March 21 – 23 in Farnborough, United Kingdom in booth K110.
Industry News | 2016-03-12 07:15:56.0
CyberOptics® Corporation today announced it will debut its much anticipated CyberGage360™, a high-precision automated 3D scanning system at the IPC APEX EXPO, March 15-17, 2016 at the Las Vegas Convention Center, CyberOptics booth #2721.
Industry News | 2017-08-23 06:53:20.0
Laser Design, Inc., a subsidiary of CyberOptics announces the adoption of the CyberGage360 3D Scanning and Inspection system by Proto Labs, the world’s fastest digital manufacturing source for custom prototypes and low-volume production parts providing unprecedented speed-to-market value for designers and engineers.
Industry News | 2016-08-17 19:43:29.0
Laser Design today announced it will showcase its CyberGage360™, a metrology-grade, ultra fast, one-button automated 3D scanning and inspection system at the 2016 International Manufacturing Technology Show (IMTS), America’s largest manufacturing show, September 12-17, at McCormick Place, Chicago. Laser Design will be demonstrating the latest in 3D scanning in Booth #E-5810.
Industry News | 2024-09-30 19:35:38.0
Seika Machinery, Inc. today announced plans to exhibit at SMTA International, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Seika Machinery will be showcasing a range of innovative products at Booth 2813 including the Sayaka CT23S router, Malcom RCX profiler, Malcom Dip-Tester, Sawa ultrasonic SC-500HE portable stencil cleaner, Unitech PCB Cleaner and Kyowa Strain Gage tester.
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