Industry News | 2012-01-07 21:49:07.0
As EMS companies have ramped up speeds to meet the high demand for electronics, equipment manufacturers have responded by developing machines that quickly shift from handling one package style to another with fewer sacrifices in precision. To help industry determine the best equipment setup to meet needs for speed, capability and accuracy, IPC has released revision A to IPC-9850, Surface Mount Placement Characterization, making it far simpler to quantify the performance of placement equipment.
Industry News | 2016-12-09 10:59:20.0
Count On Tools is pleased to announce that the company's 25th year in business has been one of tremendous growth and expansion. Earlier this year, COT purchased the suite next door. The company has knocked down the walls and broken ground on the 5,000 ft.2 expansion.
Industry News | 2012-08-03 08:30:27.0
Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2011-12-07 22:27:26.0
SWEMCO has purchased a Universal Instruments Genesis Platform production line. The new equipment set was complemented with Universal’s Dimensions® Line Manager shop floor control software. Both are now operational in SWEMCO’s Moorestown, New Jersey production facility.
Industry News | 2013-02-08 17:43:21.0
Manncorp introduces the MC-LEDV3, a new high-speed pick and place machine built to assemble LED tube lights, flexible LED strips and LED bulb boards. The MC-LEDV3 features three pick-and-place heads mounted on a high-precision, ball-screw-driven gantry. Simultaneous pickup, on-the-fly (vision based) component alignment, and feeder placement optimization combine to achieve placement rates of up to 10,000 LEDs per hour, per IPC-9850.
Industry News | 2008-09-08 03:46:39.0
Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.
Industry News | 2011-09-06 14:29:23.0
At Productronica 2011, Finetech will present a number of smart improvements and new options for the FINEPLACER® lambda.
Industry News | 2013-12-02 14:08:58.0
Universal Instruments' FuzionXC2-37™ Platform was presented the Global SMT & Packaging Global Technology Award at Productronica 2013 as the top machine in the "Placement Equipment - Low/Medium-Volume" category.