Industry News: glue temperature (Page 1 of 3)

How To Set Profile In SMT Reflow Oven

Industry News | 2018-10-18 09:37:27.0

How To Set Profile In SMT Reflow Oven

Flason Electronic Co.,limited

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

Share Your Research at SMTA International 2016!

Industry News | 2015-11-25 16:58:05.0

On behalf of the SMTA International Technical Committee, we invite you to submit a 300 word abstract of your research for the 2016 SMTA International 2016 technical conference in Rosemont, Illinois. Papers should describe significant results from experiments, emphasize new techniques, and contain technical, economic or appropriate test data. We are looking for papers on a variety of topics related to electronics manufacturing including advanced packaging/components, assembly, business/supply chain, emerging technologies, harsh environment applications, PCB technology, and process control. Materials must be original, unpublished and non-commercial in nature.

Surface Mount Technology Association (SMTA)

The glue spraying machine is another name for the hot melt glue machine. The way the hot melt glue machine sprays glue on the substrate is commonly known as the hot melt glue spraying machine.

Industry News | 2021-07-27 23:45:44.0

The glue spraying machine is another name for the hot melt glue machine. The way the hot melt glue machine sprays glue on the substrate is commonly known as the hot melt glue spraying machine. It can also be defined as follows: After the solid hot melt machine is melted, it is transported to the hot melt hose and hot melt glue spray gun through the pressurizing device, and the liquid glue is sprayed on the substrate to achieve gluing and compounding. A mechanical equipment for coating and other applications.

DONGGUAN KEQI AUTOMATION EQUIPMENT CO.,LTD

Henkel Launches New Fast Cure Silicone Ideal for Added Stability within Harsh Environments

Industry News | 2008-04-22 21:03:49.0

To offer added protection and stability for a wide range of electronics applications, Henkel has developed and made commercially available Loctite� 5210�, a new fast cure thixotropic silicone material ideal for devices that find end-use within harsh environments. With improved production throughput, operating temperature flexibility and easy storage, Loctite 5210 offers manufacturers a cost-effective alternative to traditional hot-melt glues or less aesthetically pleasing silicones.

Henkel Electronic Materials

New Reflow Oven Introduced by APS Novastar

Industry News | 2011-01-25 14:49:29.0

New Reflow Oven Introduced by APS Novastar - The ERO-500 Reflow Soldering System, A Five Zone, Cost-Effective Reflow Solution for Small to Medium Volume Lead-Free SMT Production and Prototyping.

DDM Novastar Inc

CeTaQ Offers Stability Validation of Reflow Ovens

Industry News | 2008-10-16 15:42:40.0

BEDFORD, NH � October 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes now offers stability validation of reflow ovens.

CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Industry News | 2017-08-08 09:40:33.0

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE Advanced Materials, LLC.

High Reliability & High Temperature Application Solution – Solder Joint Encapsulant Paste

Industry News | 2017-08-08 09:40:36.0

(Albany, NY) August 8, 2017 – Dr. Wusheng Yin, YINCAE Advanced Materials LLC, will be discussing a new technology – solder joint encapsulant paste for high temperature applications, at the 2017 SMTA International Conference in Rosemont, IL, as a potential solution to the current limitations and challenges presented by miniaturization. As miniaturization continues to be the driving force, the industry is beginning to face challenges associated with this trend including: warpage and reliability issues.

YINCAE Advanced Materials, LLC.

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