Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2010-03-27 20:30:39.0
Ovation on Booth 1173 at APEX is focused on innovative tools that optimize customers’ print processes to deliver great returns on investment. Taking centre stage is Grid-Lok Gold, the company’s latest fully automatic tooling solution for board and substrate support being launched at APEX 2010. Accompanying is Magna Print, a universal squeegee blade holder and paste deflector system – complete with compelling special APEX offer.
Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2022-03-08 11:31:41.0
New Adam Tech Cable/Connector Assembly from Omni Pro Supports Speeds up to 48GBPS
Industry News | 2013-11-14 18:35:01.0
Barry Industries introduces their line of hermetically sealable HTCC Quad-Flat-No-Lead (QFN) packages with air cavity for high frequency applications. These QFN packages are available in six (6) sizes from 3mm to 8mm with standard JEDEC MO-220 footprints.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2021-03-03 14:17:42.0
New CIT Relay & Switch IP67 Process Sealed VM3S Series Snap-Action Switch Protects Against Environmental Distress
Industry News | 2003-04-22 08:10:17.0
EAO introduces the 1K2, a superior quality changeover slide switch recommended for PCB configuration applications. The products is recommended for PCB configuration applications and occupies a board space measuring only 10mm x 2.5mm with a height of 4.5mm excluding actuator.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
