Industry News | 2011-09-06 15:20:36.0
SMTA China announced the Best Paper/Presentation and Best Exhibit Awards at its annual awards presentation held in conjunction with SMTA China and Hong Kong Chapter Breakfast Reception, which took place August 31, 2011 at the Ritz-Carlton Hotel in Shenzhen.
Industry News | 2013-10-28 16:31:54.0
IPC Conference on Solder and Reliability: Materials, Processes and Tests, November 13–14 in Costa Mesa, Calif.
Industry News | 2020-01-29 07:33:26.0
IPC announces the winners of the IPC APEX EXPO 2020 Innovation Awards, a celebration of the innovators who are changing the technological landscape of the electronics industry.
Industry News | 2013-02-20 18:54:10.0
IPC — Association Connecting Electronics Industries® presented Committee Leadership, Distinguished Committee Service and Special Recognition Awards at IPC APEX EXPO® at the San Diego Convention Center.
Industry News | 2019-05-16 01:27:23.0
There are several surface treatment for PCB board: bare board (no treatment on the surface), rosin board, OSP (Organic Solderability Preservatives), HASL (lead tin, lead-free tin), plating gold, immersion gold, etc., these are relatively conscious treatment. Many people can't tell the difference between plating gold and immersion gold, thinking that it is the same thing, it is a big mistake. The following is a brief introduction to the difference between plating gold and immersion gold.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2018-11-14 15:31:00.0
With a wide range of inspection systems and camera modules, Viscom AG is offering outstanding solutions for fast, high-precision wire bond production inspections. At the electronica trade show in Munich from November 13-16, visitors can experience firsthand what 3D measurement contributes to product quality in this field.
Industry News | 2012-05-11 20:19:04.0
Hesse & Knipps, Inc., the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, will discuss "Large Diameter Wedge Bonding of Round and Ribbon Wire for Automotive Applications" during IMAPS 3rd Advanced Technology Workshop and Tabletop Exhibition on Automotive Microelectronics and Packaging, taking place at the Dearborn Hotel in Dearborn, Michigan May 22-24, 2012.
Industry News | 2018-03-13 18:47:01.0
TopLine will once again be the premier sponsor of the upcoming IMAPS Wire Bonding Conference. In making the announcement, TopLine CEO Martin Hart stated that he is delighted to support the conference as the leading sponsor for the second time. The Wire Bonding workshop and tabletop exhibition will be held October 8, 2018 in California at the Pasadena Convention Center. The event is co-located with the IMAPS 51st Symposium on Microelectronics.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
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