Industry News: heat sink mechanical stress (Page 1 of 5)

SMTA International Concludes Successfully

Industry News | 2011-10-28 22:56:38.0

The SMTA released a summary today of the SMTA International Conference and Exhibition which attracted more than 1,000 attendees from 25 countries. The event took place October 16-20 at the Fort Worth Convention Center in Fort Worth, Texas.

Surface Mount Technology Association (SMTA)

Tactilus® Sensor System Ensures Optimal Heat Sink Efficiency

Industry News | 2010-09-21 09:46:59.0

Dynamic Advance Allows Engineers to Instantaneously Map and Measure Pressure Distribution between Heat Sinks and Components in Real Time

Sensor Products Inc.

Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications

Industry News | 2010-08-27 15:08:50.0

Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. SMT has introduced several machines that accommodate larger, odd shaped substrates. The machines offer the same speed, precision, and repeatability found on SMT’s solder paste printers. This allows heat sink manufacturers to benefit from using proven, cost effective screen print technology

Surface Mount Techniques

New fanSINKSTM Cool Hot Components in Sizes from 27mm to 70mm

Industry News | 2021-10-28 11:44:57.0

Advanced Thermal Solutions, Inc. (ATS) now provides fanSINKSTM heat sinks for component sizes ranging from 27mm to 70mm square. The wider size range accommodates hot semiconductor components, including FPGAs, ASICS and other package types used in telecomm, optics, test/measurement, military and other applications.

Advanced Thermal Solutions, Inc

Krayden Releases 3-6751 Thermally Conductive Adhesive from Dow Corning

Industry News | 2010-11-09 19:19:27.0

Krayden, Inc. debuts Dow Corning’s 3-6751 Thermally Conductive Adhesive used for bonding heat sinks to electronic devices and PCBs to substrates.

Krayden Inc.

AI Technology, Inc. (AIT) Releases COOL-PAD™ CPR (Conformal Pad) 7154: Second Generation (US Patent 6,496,373).

Industry News | 2014-03-20 14:21:26.0

COOL-PAD™ CPR 7154 provides both compressibility and conformability with phase-change ability to achieve the best of thermal grease performance.

AI Technology, Inc. (AIT)

TopLine® Awarded US Patent for CCGA Lead Free Solder Columns

Industry News | 2021-04-01 08:18:33.0

TopLine Corporation has been granted US patent 10,937,752 for Lead Free Solder Columns for Column Grid Array Substrates. TopLine holds 7 patents in the field of Column Grid Arrays, also known as CCGA.

TopLine Dummy Components

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Industry News | 2010-09-30 17:36:09.0

Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.

Saturn Electronics Corporation

Surface-mount technology

Industry News | 2018-10-18 09:15:23.0

Surface-mount technology

Flason Electronic Co.,limited

Causes of Cracking of Stainless Steel Welded Tube

Industry News | 2023-11-29 08:23:40.0

Causes of Cracking of Stainless Steel Welded Tube

Threewaysteel

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