Industry News: heat slump (Page 1 of 1)

NEW CHIPBONDER ELIMINATES TRANSPORT OF DANGEROUS GOODS

Industry News | 2012-10-24 09:24:51.0

Recently, compounds found in surfacemount adhesives (aka: SMA's, chipbonders) were classified as dangerous goods (UN3077 & UN3082) resulting in an immense increase to the end user’s cost due to the new classification regarding transport costs.

Adtool Corporation

Lead-free Reflow Profile: Soaking type vs. Slumping type

Industry News | 2018-10-18 08:44:36.0

Lead-free Reflow Profile: Soaking type vs. Slumping type

Flason Electronic Co.,limited

Seika Machinery Presents New Flagship Viscometer from Malcom

Industry News | 2022-06-24 10:18:52.0

Seika Machinery, Inc. is pleased to introduce Malcom's new flagship CE certified viscometer as the industry standard for testing solder paste viscosity. The new Malcom PCU-285 Viscometer features an onboard PC with a full LCD touchscreen display. The heating also has been improved for faster and more stable temperature control.

Seika Machinery, Inc.

Indium Corporation to Feature Solutions for Thermal Management and Advanced Packaging at IMAPS Symposium

Industry News | 2023-09-25 20:04:34.0

Indium Corporation® will proudly feature an array of innovative materials solutions for thermal management and advanced packaging applications at the IMAPS International Symposium on Microelectronics, October 3-4, in San Diego, California.

Indium Corporation

Nihon Superior to Highlight Advanced Soldering Materials at SMTAI 2010

Industry News | 2010-10-04 17:16:14.0

Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that it will highlight its SN100C P602 Solder Paste and NS-F900 Wave Soldering Flux in booth 226 at the upcoming SMTA International exhibition, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase the Newest Addition to the SN100C Lead-Free Solder Series at the 2012 IPC APEX Expo

Industry News | 2012-01-21 16:28:10.0

Nihon Superior will introduce the newest addition to its SN100C lead-free solder series in Booth #3044 at the upcoming IPC APEX Expo, scheduled to take place February 28 - March 1, 2012 at the San Diego Convention Center in California.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Range of Innovative Products at the 2013 IPC APEX EXPO

Industry News | 2013-01-16 08:45:06.0

Nihon Superior Co. Ltdwill introduce a range newly developed products that offer solutions for some of the challenges the electronics industry is now facing, lead-free die attach, void minimization, environmental protection, and process yields.

Nihon Superior Co., Ltd.

Henkel shows positive trend in Q2

Industry News | 2009-08-07 14:21:05.0

“Again in the second quarter of 2009, Henkel felt the effects of the continuing world economic recession. Nevertheless, all our business sectors were again able to outstrip their relevant markets,” said Kasper Rorsted, Chairman of the Henkel Management Board. “Our Laundry & Home Care business sector actually surpassed the good results of the first quarter, while Cosmetics/Toiletries again showed a very positive performance.

Henkel Electronic Materials

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