Industry News: high density packaging (Page 1 of 409)

Heller Industries Announces Joint Development Agreement with IBM for Fluxless Mass Reflow Soldering Process for High Volume Manufacturing

Industry News | 2013-08-15 20:58:22.0

Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.

Heller Industries Inc.

Heller Industries Will Feature the MK7 Reflow Oven Featured at IPC APEX 2022 Booth #1920

Industry News | 2021-11-08 14:38:39.0

Heller Industries, a leading supplier of reflow soldering ovens for electronic manufacturing and pressure curing ovens for back-end semicondutor manufacturing, today announced they will be exhibiting their new MK7 reflow oven at the San Diego Conference Center January 25-27, 2022.

Heller Industries Inc.

HELLER Partners With Circuit Technology, Restronics

Industry News | 2024-06-06 21:18:44.0

Heller Industries announced two hirings today to strengthen their market position in the Eastern United States. Bob Doetzer, President of Circuit Technology Inc., has been appointed sales representative for North and South Carolina. Circuit Technology is a manufacturer's representative and IPC training group specializing in products and services covering circuit board production and semiconductor assembly.

Heller Industries Inc.

See GPD Global's PCD Technology at IMAPS Device Packaging 2011

Industry News | 2011-02-17 15:04:54.0

GPD Global will highlight its Positive Cavity Displacement (PCD) Dispensing in Booth #27 at the upcoming IMAPS Device Packaging conference and exhibition, scheduled to take place March 8-9, 2011 at the Radisson Fort McDowell Resort and Casino in Scottsdale, AZ.

GPD Global

GPD Global Signs Distribution Agreement with Aegis for CircuitCAM Express

Industry News | 2013-06-07 15:36:04.0

GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.

GPD Global

Learn How to Improve Dispensing Reliability and Accuracy with GPD Global at SMTA International

Industry News | 2013-09-12 14:24:27.0

GPD Global will exhibit in Booth #215 at the upcoming SMTA International Exhibition. Company representatives will demonstrate the latest in dispense technology from GPD Global's PCD line of continuously volumetric dispense pumps, along with its compact, versatile NCM5000 jetting series.

GPD Global

GPD Global Live Demos at IPC APEX in Las Vegas Convention Center

Industry News | 2016-02-27 22:07:08.0

GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.

GPD Global

Deep Micro-vias Available on Large-format PCBs

Industry News | 2003-02-25 08:18:29.0

Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.

SMTnet

Rogers Corp. Introduces R/flex� 3850 Bi-Clad Liquid Crystalline Polymer Material for Multi-layer Thin-Film PCB Construction

Industry News | 2003-06-24 08:14:51.0

R/flex� 3850 laminate is produced in a range of copper and LCP thicknesses, just as the single-clad laminate, and is available in standard panel formats.

SMTnet

Virtex-II FPGA Prototyping Boards Enable Complex FPGA Design Evaluation & Testing

Industry News | 2003-06-16 09:12:35.0

Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces

SMTnet

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