Industry News: high-tech (Page 1 of 72)

U.S. Technology Exports Down 26 Percent Since 2000

Industry News | 2003-06-23 09:04:32.0

China Replaces Japan and Mexico as Largest Supplier of Electronics to the United States

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AeA Expands Micro Cap Financial Conference to Web to

Industry News | 2003-04-14 09:17:40.0

AeA Micro Cap Virtual Conference to be held Online May 16th

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Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

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Circuits West Invests in AOT

Industry News | 2003-03-28 08:46:12.0

The high scan speeds and fast setup times of the Excalibur system make it a good choice for this sector of the bare-board PCB manufacturing industry

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M~Wave in 3-year PCB Deal with CE Electronics

Industry News | 2003-02-19 09:12:55.0

M~Wave Said It Expects to Ship Approximately $750,000-$1 million of PCBs to CEE Over the Term of the Agreement

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Teradyne Awarded Two Service Excellence Awards at APEX

Industry News | 2003-04-07 10:25:38.0

Customers Commend Teradyne's Assembly Test and Connection Systems Divisions

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Optical MEMS Finding Greater Opportunities in Non-Telecom Products

Industry News | 2003-07-02 09:35:30.0

As a result, sales of optical MEMS, into segments other than telecommunications, are forecast to grow at a CAGR of 15.8% over the next five years.

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PCB East 2003 Announces Final Conference and Exhibition Program

Industry News | 2003-07-10 08:45:50.0

UP Media Group Inc. today announced the final schedule of events for the eighth annual PCB Design Conference East

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Titan General Holdings, Inc Reconstitutes Board of Directors

Industry News | 2003-05-09 08:35:07.0

Bringing the board experience more in line with its business objectives

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Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

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