Industry News | 2003-04-02 09:03:49.0
Configural Recognition(TM) Object and Image-Analysis Technology Enables One-Hour Program Generation
Industry News | 2018-04-15 20:01:15.0
SMTA Europe announces Session 4 Technical Program on Electrochemical Reliability at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2021-07-19 16:50:44.0
The SMTA is pleased to announce the finalized technical program for the High-Reliability Cleaning and Conformal Coating Conference. The in-person event takes place October 5-7, 2021 at the DoubleTree by Hilton - Dallas Market Center in Dallas, Texas, USA.
Industry News | 2018-10-27 16:00:41.0
The SMTA Capital Chapter is excited to host a Chapter Meeting on November 8th from 5:00 PM to 7:30 PM at ZESTRON, Manassas, VA. A technical engineer from DFR Solutions will be presenting “Reliability Modeling and Simulation of Commercial-Off-The-Shelf (COTS) Assemblies Using Sherlock.”
Industry News | 2012-10-18 19:02:31.0
IPC and SMTA jointly announce the agenda for Session 2 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2020-09-17 12:26:40.0
Today, IPC issued a blog post in support of the FY 2021 National Defense Authorization Act (NDAA) provisions that would bolster the resiliency and security of the electronics manufacturing ecosystem, including printed circuit board (PCB) fabrication and printed circuit board assembly (PCBA), the green-and-gold hardwiring at the core of all electronics systems. These provisions, approved in both the U.S. House and Senate, aim to improve the security of electronics purchased by the Defense Department.
Industry News | 2020-08-07 07:29:43.0
The SMTA Capital Chapter is excited to host its first FREE webinar on Wednesday, August 19th. The webinar will include an informative presentation given by industry expert Norman Armendariz, Ph.D. of Raytheon Company on "DfR- Design for Rinse-ability: Effect of SMT Component Package Design on Cleaning Effectiveness."
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2021-02-25 13:34:06.0
The best technical conference paper of IPC APEX EXPO 2021 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will be recognized during show opening remarks on Tuesday, March 9.
