Industry News: hva 120 weight (Page 1 of 2)

Count On Tools Inc. Will Debut New StripFeeder Lightweight Rails at APEX

Industry News | 2016-02-15 09:46:51.0

Count On Tools has released a new accessory – the Lightweight Rails – for its award-winning line of StripFeeder products. The StripFeeder Lightweight Rails enable customers to take full advantage of the StripFeeder platform when operating in OEM tray towers with weight limits on tray capacity. The skeletonized design reduces carrier tray weight by 40-50 percent. StripFeeder Lightweight Rails are available in 0.25" (6mm), 0.50" (12mm), 0.75" (19mm), and 1.125" (28mm) pocket depths.

Count On Tools, Inc.

Count On Tools Inc. Introduces the StripFeeder Lightweight Kit

Industry News | 2016-02-24 19:42:19.0

Count On Tools has released a new version in its award-winning line of StripFeeder products – the StripFeeder Lightweight. Increased demand for use of the StripFeeder platform in OEM automated tray towers prompted the need for a low-mass version to accommodate machine weight limits on tray capacity. The StripFeeder Lightweight system allows customers to take advantage of the StripFeeder platform in these specific applications.

Count On Tools, Inc.

EyePoint u22

Industry News | 2021-06-16 06:24:57.0

The EyePoint u22 is a simple, compact, programmable desktop instrument. It has a minimalistic design and a lower weight due to the plastic case. Miniature two-channel system for localizing faulty electronic components on PCB using ASA method. For work you need connect EyePoint u22 to the PC via USB. EyePoint u22 determines the failures of all kinds of electronic components, used to test board components; connected to a computer, has a USB-flash drive with the necessary software and instructions. Used in the professional field of repairing PCB and testing electronic components.

Engineering Physics Center of MSU

Endicott Interconnect Technologies' Wire Bond Product Launched into Space.

Industry News | 2007-11-08 21:34:39.0

Endicott Interconnect Technologies, Inc. (EI) announced today that its ultra fine pitch wire bond plastic ball grid array (PBGA) substrates and assembled modules have performed perfectly during their first launch into space. They were supplied to Northrop Grumman Corporation (NYST: NOC) for integration into the payload modules on the Orbital Express system.

i3 Electronics

New Yorker Electronics Releases Mallory Sonalert TS5 Series Silver Case Tantalum Capacitors

Industry News | 2021-08-05 16:18:56.0

Mallory Sonalert Tantalum Capacitors Demonstrate Resistance to Shock, High Temperature, and Vibration; Ideal for Consumer and Military Applications

New Yorker Electronics

New Task Kit: LCR-Reader-MPA Professional

Industry News | 2019-12-31 13:46:06.0

Siborg's LCR-Reader-MPA offers the highest basic accuracy and most features out of all their tweezer based multimeters. The Professional Task Kit is a pre-bundled device with additional accessories.

Siborg Systems Inc

LCR-Reader-MPA Makes Debut at Nepcon 2019

Industry News | 2019-06-28 14:40:30.0

Siborg Systems Inc. gave the first viewing of LCR-Reader-MPA for the first time in Korea from May 15- 17 2019

Siborg Systems Inc

New Era in Testing DUT over Temperature

Industry News | 2016-05-13 11:56:03.0

The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.

Mechanical Devices

New Era in Testing DUT over Temperature

Industry News | 2016-05-13 12:00:12.0

The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.

Mechanical Devices

LCR-Reader-MPA; Updated Multifunctional Multimeter

Industry News | 2019-04-15 16:47:35.0

New model of LCR-Reader-MP on the horizon; updated model offers record high basic accuracy and unparalleled amount of test functions

Siborg Systems Inc

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