Industry News | 2019-07-09 20:13:00.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, August 8, 2019 at the Holiday Inn Cleveland Strongsville in Strongsville. The company will showcase its PF735-PQ10 low temperature solder paste.
Industry News | 2013-03-18 13:30:19.0
OK International will demonstrate the new Metcal MX-5200 Soldering, Desoldering and Rework Series in Booth # 9-517 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2013-04-04 13:49:19.0
Juki Automation Systems announces that it will exhibit their new line software in Booth #7-333 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2014-04-07 19:27:40.0
VJ Electronix, Inc.ill exhibit in Hall 7, Booth 233 at SMT/Hybrid/Packaging, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2019-03-03 18:54:54.0
PDR today announced the release of Re-Ball Mode Software now available as part of its award-winning ThermoActive Suite Software Package. This latest feature allows the operator to select the software configuration, temperature management and profile management necessary for the successful completion of BGA re-balling operations when using PDR Systems.
Industry News | 2022-10-06 18:14:49.0
PDR will exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. The PDR team will showcase the IR-E6 XL Evolution Series and IR-E3 Series rework systems in Booth #1256.
Industry News | 2017-03-30 14:27:18.0
SMT Hybrid Packaging, hall 4A, stand no. 122. With a combination of intelligent software and the high-performance camera module XMplus, Viscom AG is perfecting automatic optical inspection (AOI), which also includes optimal 3D solder joint measurement. As a result, users receive definite and easy-to-interpret information and, with it, the best possible quality assurance for electronic components.
Industry News | 2010-03-24 13:39:18.0
MARTIN, a FINETECH company, will demonstrate the Reball 03.1 unit in booth #638 at the upcoming IPC/APEX exhibition, scheduled for April 6-8, 2010 at the Mandalay Bay Convention Center in Las Vegas, NV.
Industry News | 2010-11-01 21:16:27.0
Christopher Associates today announced that the company now carries Koki’s Surface Mount Adhesives (SMAs). The silica-filled epoxies are ideal for chip attachment during wave solder and double-sided reflow.
Industry News | 2007-07-26 16:51:57.0
New improved facility boasts many improvements for enhanced production / service
