Industry News: ieee (Page 12 of 28)

JTAG Technologies - 25 Years of Innovation and Dedication to Boundary Scan

Industry News | 2018-10-27 16:12:01.0

This year (2018) JTAG Technologies are proud to celebrate their 25th year of developing, supplying and supporting world-class board (PCBA) test and programming solutions based on IEEE Std 1149.x .

JTAG Technologies B. V.

Indium Corporation Experts Honored with IMAPS 2018 Best Paper Award

Industry News | 2019-01-15 19:22:09.0

Indium Corporation expert Dr. Ning-Cheng Lee, Vice President of Technology, was honored with a Best Paper Award from IMAPS’ 51st International Symposium on Microelectronics, recently held from October 8-11, 2018, in Pasadena, California.

Indium Corporation

CyberOptics to Present Technical Paper'Fast, 100% Wafer Bump Metrology and Inspection' at Virtual IEEE PAINE Conference

Industry News | 2020-11-18 15:38:26.0

CyberOptics® Corporation (NASDAQ: CYBE) will present at the Virtual IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) on December 16th at 8:00amCT.

CyberOptics Corporation

Indium Corporation Prepared to Deliver Three Presentations at APEC 2024

Industry News | 2024-02-19 11:47:54.0

As one of the leading materials providers to the power electronics assembly industry, three Indium Corporation team members will share their insights and knowledge on a variety of industry-related topics throughout APEC 2024, February 25-29, in Long Beach, CA.

Indium Corporation

Tyco Electronics Releases First Connector For 10-Gigabit Transceivers

Industry News | 2001-03-27 08:27:29.0

Tyco Electronics today announced the release of the AMP PT70 connector, a 70-pin board-mounted card edge connector that will connect the new 10-Gigabit Ethernet pluggable fiber optic transceivers to the printed circuit board. The AMP connector's electrical input/output interface is based on XAUI (10G Attachment Unit Interface) protocols.

TE Connectivity

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:10.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:12.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

JEDEC and IPC Release Tin Whisker Acceptance Testing Standard and Mitigation Practices Guideline

Industry News | 2006-05-04 17:10:18.0

Documents to help manufacturers reduce the risk of tin whiskers in Pb-free products

iNEMI (International Electronics Manufacturing Initiative)

Agilent Technologies to Demonstrate Technology Leadership in Military Communications Solutions at MILCOM 2007

Industry News | 2007-10-29 22:37:08.0

Agilent Technologies Inc. (NYSE: A) today announced that it will demonstrate its leadership offerings in military communications solutions at MILCOM 2007, including the following application areas: R&D, RF, operational test, networking, physical layer test, and internet security and monitoring.

Agilent Technologies, Inc.

TRI integrates ASSET�’s ScanWorks� boundary-scan technology into its test systems.

Industry News | 2008-04-22 21:10:46.0

Combining JTAG with ICT test systems delivers higher test coverage and reduces time-to-test

ASSET InterTech, Inc.


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