Industry News | 2010-04-30 18:47:15.0
SMTA China announces that it presented awards for the 10 best papers/presentations and two best exhibits at the SMTA China East 2010 Conference Award Presentation Ceremony, held on Wednesday, April 21, 2010 at the Shanghai Everbright International Hotel in conjunction with the SMTA China Annual Breakfast Reception.
Industry News | 2018-04-16 20:18:35.0
SMTA Europe announces Session 5 Technical Program on Adhesives and Coatings at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2018-04-22 19:12:45.0
SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2017-05-10 18:15:53.0
Nordson ASYMTEK and Nordson MARCH, Nordson companies (NASDAQ: NDSN), will present papers at the Conformal Coating Materials and Processes session at the Contamination, Cleaning, and Coating Conference being held in Amsterdam, Netherlands. Transitioning from Manual to Automated Conformal Coating, by Michael Szuch, Nordson ASYMTEK and Optimizing the Plasma Treatment Process Prior to Conformal Coating to Eliminate ESD Induced Failures, by David Foote, Nordson MARCH, will be presented on Wednesday, May 24, 2017.
Industry News | 2008-10-25 22:05:53.0
ROSEMONT, IL � Industry-leading associations IPC and SMTA jointly announce that Dr. Harald Wack (Session Chair) of Zestron Corporation, Jason Keeping of Celestica, Barry Richie of Dow Corning Corporation, Phil Kinner of Humiseal, and Lamar Young of Specialty Coating Systems will present in Session 5 on Conformal Coating Adhesion. The symposium, jointly sponsored by IPC and SMTA, will be held at Crowne Plaza Chicago O'Hare in Rosemont, IL on October 28-29, 2008.
Industry News | 2009-02-21 17:56:00.0
BANNOCKBURN, Ill. and ARLINGTON, Va., USA, February 19, 2009 � IPC � Meeting the requirements of RoHS (restriction of the use of certain hazardous substances in electrical and electronic equipment) compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the electronic interconnect industry. To help companies work toward their compliance goals, IPC and JEDEC present �Transitioning to Lead Free � Strategies for Implementation,� a three-day conference to be held March 3�5, 2009 in Santa Clara, Calif.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2013-02-14 08:18:47.0
IPC – Association Connecting Electronics Industries® has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2013
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Industry News | 2018-04-17 21:06:54.0
SMTA is excited to announce the technical program has been finalized and registration is now open for the International Conference for Electronics Enabling Technologies. The event will be held June 5-7, 2018 in Markham, Ontario, Canada.
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