Industry News: infrared red component manufacturing process (Page 10 of 10)

A One-Stop Showcase to Promote Development in Electronics Manufacturing & Highlight Emerging Industry Trends

Industry News | 2011-08-22 20:01:11.0

As well as a diverse array of exhibits, NEPCON South China 2011 will feature a variety of topical and popular conferences. Together, the displays and seminars will highlight development trends in electronics manufacturing markets and technologies.

Reed Exhibitions

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

STMicroelectronics expands into 3D depth sensing with latest time-of-flight sensors

Industry News | 2024-02-26 14:20:57.0

STMicroelectronics (NYSE: STM) announced an all-in-one, direct Time-of-Flight (dToF) 3D LiDAR (Light Detection And Ranging) module with market-leading 2.3k resolution, and revealed an early design win for the world's smallest 500k-pixel indirect Time-of-Flight (iToF) sensor.

3M Electrical Solutions Division

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