Industry News: instruments 2000 2000 (Page 1 of 92)

U.S. Technology Exports Down 26 Percent Since 2000

Industry News | 2003-06-23 09:04:32.0

China Replaces Japan and Mexico as Largest Supplier of Electronics to the United States

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Newport Corporation has New Board Members

Industry News | 2003-04-21 09:53:12.0

Michael T. O'Neill and Peter J. Simone

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Connectors Save Space in Basestation Power Supply

Industry News | 2003-04-29 08:27:33.0

Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.

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Pac Tech USA Offering Contract Wafer Bumping, Stencil Services

Industry News | 2003-01-27 10:27:31.0

At a New Facility Within the Company's U.S. Headquarters

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SVI Plc Forecasting $120M Sales by 2005

Industry News | 2003-03-04 08:28:08.0

Thanks in part to an increase in capacity following the months-early opening of a second factory

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AsusTeK Selects Cadence SPECCTRAQuest For High-Speed PCB System Development

Industry News | 2003-05-21 09:03:19.0

Cadence Design and Analysis Solution Used for Asus's Ultra-high-frequency PCB Designs

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2002 NEMI Roadmap Points to Areas of Opportunity for Industry

Industry News | 2003-04-07 10:16:38.0

Portable Products and Optoelectronic Applications Still Hold Promise for Growth

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Camtek Introduces the Dragon, a New, Fast AOI System with Fully-automated Material Handling

Industry News | 2003-03-25 09:15:19.0

The Dragon was demonstrated at the CPCA show in Shanghai last week

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Matsushita Electric (Panasonic) Completes Switch to Lead-Free Solder Used for Printed Circuit Boards

Industry News | 2003-05-28 08:20:13.0

Aiming to promote its environmental activities on a global basis, the use of lead-free solder conforms to the European Union's regulation on restrictive use of toxic substances.

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Legacy Electronics Receives U.S. Patent for 3-D Memory Module with Canopy-type Carriers

Industry News | 2003-05-30 08:26:20.0

The inventors of this module type and holders of the patent are chief technical officer Kenneth J. Kledzik and president Jason C. Engle, both of San Clemente, California.

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