Industry News: instruments 2012 multi pitch (Page 1 of 3)

Omron Demos High-Speed PCB Inspection Technology Solutions at the 2012 IPC Midwest Conference & Exhibition

Industry News | 2012-08-03 08:30:27.0

Omron Inspection Systems (www.omron247.com) will display and demo its latest concepts and enhancements in AOI systems at the 2012 IPC Midwest Conference & Exhibition

Association Connecting Electronics Industries (IPC)

SMTA (Surface Mount Technology Association) all day Chapter Meeting at Textron Defense Systems on Tues., June 26, 2012:

Industry News | 2012-06-18 14:49:38.0

Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA

Surface Mount Technology Association (SMTA)

I.C.T Full-auto SMT Production Line

Industry News | 2022-10-20 14:32:44.0

Full-auto SMT Production Line includes solder paste printer machine, SMT placement machine (upper surface electronic components), reflow soldering oven machine, plug-in, wave furnace, testing machine etc. The wide application of Full-auto SMT Production Line promotes the miniaturization and multi-function of electronic products, and provides conditions for mass production and low defect rate production.

Dongguan Intercontinental Technology Co., Ltd.

Omron Previews New Inspection Technology at IPC APEX Expo 2012

Industry News | 2012-02-07 02:13:56.0

Omron Inspection Systems will debut a new concept in its AOI systems-the VT-S720 Inspection System featuring 3D reconstruction measurement technology - at the IPC APEX Expo. Visit Omron at booth #2649 to get an in-depth demo from Omron’s experts on the VT-S720, as well as the VT-RNSII in-line and benchtop, post reflow AOI inspection systems and the VP5200 in-line 3D solder paste inspection system.

Omron Inspection Systems

Let's Test - Meet Acculogic at the 2012 IPC APEX Expo for a Demonstration

Industry News | 2012-01-23 14:28:54.0

Acculogic will showcase its award-winning FLS 980Dxi Flying Scorpion™, the only patented double-sided, multi-probe (22) flying probe system with 3-D probing, analog, digital and boundary scan test capability on all probes (top- and bottom-side) in Booth #3321 at the upcoming IPC APEX Expo.

Acculogic Inc.

Universal Highlights New Platform and Emerging Market Focus at APEX 2012

Industry News | 2012-02-23 16:51:16.0

Universal Instruments sets a higher standard for versatility and performance in a multifunction surface mount platform with the introduction of the Genesis GX-37D to the Americas market at the APEX 2012. Universal will demonstrate the exceptional capabilities of the GX-37D on booth #2737, as well as share the company’s vision into the exciting new markets shaping the industry landscape and Universal’s unique position as a productivity and profitability leader in these markets.

Universal Instruments Corporation

Omron Demos High-Speed PCB Inspection Technology Solutions at SMTA International 2012

Industry News | 2012-10-10 16:35:28.0

Omron Inspection Systems will display and demo its latest concepts and enhancements in AOI systems at SMTA International Visit Omron at booth #631 to get an in-depth demonstration from Omron's experts on the VT-RNSII Inline and Bench Top Post-Reflow Inspection Systems, and the VP5200V Inline 3D Solder Paste Inspection System.

Omron Inspection Systems

ESSEMTEC to Demonstrate Solutions for the Entire Production Process at the 2012 IPC APEX Expo

Industry News | 2012-01-21 00:40:52.0

Essemtec will showcase flexible Swiss-made solutions in Booth #1617 at the upcoming IPC APEX Expo.

ESSEMTEC AG

esse & Knipps Introduces New Extreme Loop Former Bondhead for Heavy Wire Bonders to Support High Density Module Bonding

Industry News | 2012-09-04 08:51:32.0

Hesse & Knipps, Inc., (www.hesse-knipps.com) has added the HBK08 Loop Former Bondhead to its BONDJET BJ935 and BONDJET BJ939 fully automatic heavy wire bonders to support growing requirements for high density module bonding.

Hesse Mechatronics

Universal Announces Platform Feeder Upgrade Path

Industry News | 2011-06-22 00:38:04.0

Universal Instruments announces an unprecedented upgrade path for its customers to enhance the performance of their surface mount platform feeders. The offer features two distinct options for improving feeder functionality to maximize machine and production line efficiency: a Gold Feeder Remanufacture Program, and a “Green-for-Gold Plus” Feeder Recycle Program.

Universal Instruments Corporation

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