Industry News: koh young technologies ky 8030-3 (Page 1 of 5)

Christopher Associates to Highlight Its Latest Inspection Solutions at the SMTA Nutmeg Expo & Tech Forum

Industry News | 2010-11-10 19:07:32.0

Christopher Associates will showcase its latest inspection solutions at the upcoming SMTA Nutmeg Expo & Tech Forum, scheduled to take place Wednesday, November 17, 2010 at the Crowne Plaza Hotel in Southbury, CT.

Christopher Associates Inc.

Christopher Associates Announces Product Lineup for SMTAI 2010

Industry News | 2010-10-01 00:14:38.0

Christopher Associates will display a comprehensive portfolio of exciting new technologies in booth #214 at the upcoming SMTA International, scheduled to take place October 25-28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

Christopher Associates Inc.

Christopher Announces Sale of 250th SPI System in North America

Industry News | 2010-11-12 15:33:13.0

Christopher Associates announces the sale of its 250th solder paste inspection system in North America. Magna E-Car Systems, a recently formed joint venture between Magna International and the Stronach Trust, recently purchased a KY-8030-3.

Christopher Associates Inc.

Christopher Associates’ Koh Young Inspection Systems Accredited as Most Cost-Effective Solder Paste Inspection Systems in North America

Industry News | 2010-07-08 13:05:54.0

Christopher Associates announces that Koh Young’s KY8030-3 has established its credentials as the best and most cost-effective solder paste inspection system in the North American market with several key “wins” in the past 90 days with small, mid-sized and large manufacturers in several market sectors.

Christopher Associates Inc.

Koh Young SPI Dispenses Solder Paste for 0402M (01005) Microchips

Industry News | 2018-09-04 10:25:16.0

Seoul, South Korea – Flexible SMT production has entered into a new dimension. Koh Young Technology’s 3D SPI (Solder Paste Inspection) system has now expanded its solution to perform complex dispensing. Koh Young highlighted the latest innovations, including its new high-precision, integrated dispenser for the KY8030-3 3D SPI in Stand 1F45 at NEPCON South China, which occurred August 28-30, 2018 in Shenzhen, China.

Koh Young America, Inc.

Computrol Triples Its Medium Volume Inspection Capability with Three Koh Young SPI Systems

Industry News | 2016-06-13 18:56:40.0

Computrol has purchased three KY-8030-3 in-line, fully automated SPI systems from Koh Young Technology.

Computrol, Inc.

Koh Young Technology to Exhibit at JPCA 2018

Industry News | 2018-05-28 21:09:28.0

Seoul, South Korea – Koh Young Technology will exhibit “True 3D Smart Factory solutions powered by the AI platform” in booth 4C-20 at the upcoming JPCA show scheduled for June 6-8, 2018 at the Tokyo Big Sight in Japan. The company will highlight the high-speed Zenith UHS 3D AOI, KY8030-3 3D SPI, as well as comprehensive KSMART Industry 4.0 solution

Koh Young America, Inc.

Koh Young Intros New Platform KY8030-3 SPI at SMTAI

Industry News | 2013-09-10 13:21:08.0

Koh Young will exhibit new SPI and AOI measurement technology at the upcoming SMTAI conference and exhibition in Fort Worth, Texas, in Booth #136

Koh Young America, Inc.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:17.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

Koh Young Exhibiting its Industry-leading 3D Inspection Solutions at SMT Hybrid Packaging 2018

Industry News | 2018-05-14 09:06:21.0

Under the slogan “True 3D Smart Factory solutions powered by the AI platform,” Koh Young Technology will exhibit in Hall 4A, Booth 233, at the upcoming SMT Hybrid Packaging show scheduled for June 5-7, 2018 at the Messe in Nuremberg, Germany. The company will display the next-generation Zenith2 3D AOI, new KY-P3 3D pin inspection solution, and the new automated solder dispensing feature on its KY8030-3 3D SPI.

Koh Young America, Inc.

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