Industry News | 2019-11-03 15:33:45.0
Nordson Test and Inspection will exhibit in Hall A2, Stand 445 at productronica, scheduled to take place Nov. 12-15, 2019 at the Neue Messe München in Munich, Germany. Systems from Nordson DAGE, MATRIX, SONOSCAN AND YESTECH will be available for demonstrations.
Industry News | 2012-10-11 19:33:07.0
IPC — Association Connecting Electronics Industries® will host “IPC Medical Industries Technical Conference: Lead-Free Reliability Readiness,” November 7–9 in Andover, Mass
Industry News | 2014-08-07 18:05:48.0
The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 9, 2014, from 9:30 am until 3:00 pm.
Industry News | 2014-09-06 19:01:47.0
he SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on September 9, 2014, from 9:30 am until 3:00 pm.
Industry News | 2011-04-01 13:21:14.0
IPC invites researchers, academics, technical experts and industry leaders to submit abstracts for the IPC Conference on Reliability: Assembly Process for a Reliable Product, November 1–2, 2011 in Irvine, Calif. Focused on reliability issues arising at the assembly level, the conference will highlight new developments in materials, process and test.
Industry News | 2012-06-29 17:09:10.0
Electronic product and manufacturing trends continue to challenge both users and providers of test and inspection technologies at all levels of the supply chain.
Industry News | 2011-04-01 13:14:24.0
The Surface Mount Technology Association (SMTA) announced today that Mark Brillhart, Vice President, Technology and Quality, Cisco, would keynote on the state of the electronics industry at its 15th annual Atlanta SMTA Expo Thursday, April 21, 2011 at 9:30 am at the Gwinnett Civic Center.
Industry News | 2010-08-25 14:48:18.0
IPC — Association Connecting Electronics Industries® announces a new automated testing feature now available for purchasers of IPC electronics assembly DVD or OVT (Online Video Training) products. Automated testing can be used in conjunction with any of IPC’s extensive library of electronics assembly training videos, verifying understanding in key subject areas.
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
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