Industry News | 2018-10-08 20:18:03.0
GPD Global will exhibit at the upcoming SMTA International 2018. At booth# 517, see our automated Conformal Coating Machine with excellent repeatability for under $40,000.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2018-10-18 11:28:01.0
How to Generate Gerber Files Using Altium Designer
Industry News | 2017-07-18 13:16:28.0
Depanelizing skip routed PCB panels up to 48" long is made simple and easy with FKN Systek’s K4000 PCB singulator. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable.
Industry News | 2016-11-17 15:22:21.0
The N200 punch cleanly separates round and odd shaped panels without dust. Available for under $4,000 from FKN Systek, The N200 is a low cost top down air operated punch for singulating tab routed PCB Panels one tab at a time. An upper and lower matching knife blade is used to pinch the tabs apart.
Industry News | 2012-06-18 14:49:38.0
Reliability and Failure Analysis Seminar: Lessons Learned in Manufacturing. Presented by Universal Instruments Corporation’s Advanced Process Laboratory. Hosted by Textron Defense Systems, 201 Lowell St., Wilmington, MA
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2016-11-30 18:48:01.0
IPC announced today the October 2016 findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. The PCB book-to-bill ratio continued to strengthen, climbing to 1.08, while sales and orders were both down in October.
Industry News | 2013-09-17 07:21:08.0
The world market for PCBs reached nearly $60 billion in 2012, with 1.7 percent real growth over 2011, according to IPC’s World PCB Production Report for the Year 2012.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
