Industry News | 2008-12-02 14:39:08.0
Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.
Industry News | 2008-12-06 02:26:28.0
Minneapolis, MN � The SMTA and Chip Scale Review Magazine are pleased to announce the dates for the 2009 International Wafer-Level Packaging Conference. The 6th annual offering of the IWLPC will be held on October 27-30, 2009 at the Santa Clara Marriott in Santa Clara, California.
Industry News | 2010-06-04 00:21:31.0
Minneapolis, MN - The SMTA proudly announces the fall offerings of SMT Processes and Six Sigma/Green Belt Certification in San Jose and Orlando. The SMTA Certification program is unique, as it recognizes and certifies the entire SMT assembly process at an engineering level.
Industry News | 2011-01-18 14:37:31.0
Sponsored jointly by the SMTA and Chip Scale Review magazine, the annual IWLPC explores cutting edge topics in wafer-level packaging and IC/MEMS/MOEMS packaging, including 3D/Stacked/CSP/SiP/SoP and mixed technology packages.
Industry News | 2011-08-15 12:43:52.0
The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.
Industry News | 2021-12-21 14:47:13.0
The SMTA is pleased to announce the technical program for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 15-17, 2022 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2008-08-14 14:03:27.0
San Jose, CA � This year's fifth annual International Wafer-Level Packaging Conference (IWLPC), October 13-16, will be the largest ever, according to Dr. Ken Gilleo, IWLPC general chair.
Industry News | 2017-07-27 19:01:34.0
The SMTA and Chip Scale Review are pleased to announce the Keynote Presenters for the 14th annual International Wafer-Level Packaging Conference. The IWLPC will be held October 24-26, 2017 at the DoubleTree by Hilton Hotel in San Jose, California.
Industry News | 2009-08-07 19:24:15.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2010-06-21 14:15:46.0
Minneapolis, MN - The SMTA and Chip Scale Review magazine proudly announce that Bradley McCredie, Ph.D., IBM Fellow and Vice President of IBM Systems and Technology Group, will be the keynote speaker at the 7th Annual International Wafer-Level Packaging Conference being held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Dr. McCredie will present "Technology Scaling, Packaging, and Other Things That Might Put Our Kids Through College".
