Industry News: lifted pads after rework (Page 1 of 4)

Niche Electronics Technologies & QCMS Partner with MIRTEC to Meet High-Quality Manufacturing Standards!

Industry News | 2020-10-19 14:25:19.0

MIRTEC is pleased to announce that Niche Electronics & QCMS have selected MIRTEC's MV-6 OMNI 3D AOI machine to meet their ongoing commitment to flawless manufacturing quality. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable both facilities to achieve 100% customer satisfaction.

MIRTEC Corp

Jaguar Partners with MIRTEC to Maintain Demanding Quality Standards

Industry News | 2016-11-21 17:06:00.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that Jaguar de Mexico, has selected MIRTEC’s award-winning MV-6 OMNI 3D AOI system to maximize production efficiency and maintain demanding quality standards.

MIRTEC Corp

ALTRON Partners with MIRTEC to Provide Total Quality 3D AOI Solution

Industry News | 2016-11-07 19:40:51.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that ALTRON, Inc., a veteran-owned, service-orientated, contract manufacturing company specializing in high-quality circuit board and mechanical box build assemblies, has selected MIRTEC as its 3D AOI partner with the purchase of six MV-7 OMNI 3D AOI machines.

MIRTEC Corp

SMT Hautes Technologies Selects MIRTEC for Leading-Edge 3D AOI Technology

Industry News | 2016-11-14 20:04:34.0

MIRTEC, “The Global Leader in Inspection Technology,” is pleased to announce that SMT Hautes Technologies, has selected MIRTEC’s award winning MV-7 OMNI as their future 3D AOI platform of choice.

MIRTEC Corp

MIRTEC Awarded AOI Contract with ACD at Productronica 2011

Industry News | 2011-12-14 16:19:46.0

MIRTEC announces that ACD purchased two Mv-7xi In-Line AOI Systems during the recent Productronica Trade Fair in Germany. ACD has very high inspection standards and the new MV-7xi AOI systems will help the company continue to meet or exceed those requirements.

MIRTEC Corp

OBMFG Selects MIRTEC 3D AOI Above All Others for Inspection Performance and Ease of Programming

Industry News | 2020-06-18 14:14:42.0

MIRTEC is pleased to announce that Out of the Box Manufacturing has purchased an MV-6 OMNI to meet their ongoing commitment to continuous process improvement. The Award-Winning MV-6 OMNI is the perfect 3D Inspection Solution to enable OBMFG to provide their customers with flawless manufacturing quality and consistent on-time deliveries all at a competitive price!

MIRTEC Corp

What are the operating steps of the Full-auto SMT Stencil Printer in SMT Production Line?

Industry News | 2022-11-22 06:14:08.0

Full-auto SMT Stencil Printer is indispensable equipment in SMT production Line. It is generally composed of board mounting, solder paste, imprinting, and circuit board transfer. Widely used are Full-auto SMT Stencil Printer and semi-auto SMT Stencil Printer These two types, next, let's share with you the operating instructions of Full-auto SMT Stencil Printer.

Dongguan Intercontinental Technology Co., Ltd.

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

Intel and VJ Technologies to Present Pad Site Dress Methods at SMTAI 2010

Industry News | 2010-09-27 23:15:26.0

VJ Technologies, Inc., the leader in rework technologies and global provider of advanced X-ray inspection systems, announces that Intel’s James Wade and Raiyo Aspandiar, along with VJ Technologies’ Donald Naugler and Terry Leahy will present a paper titled “PCB Pad Site Dress Methods on BGA and Socket Pad Arrays” at the upcoming SMTA International, scheduled to take place October 24 - 28, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.

VJ Electronix

Reworkable Edgebond Adhesive Improves CBGA and BGA Thermal Cycle Performance and Eliminates Underfill

Industry News | 2011-04-07 20:23:54.0

Zymet Inc. has introduced a reworkable edgebond adhesive, UA-2605, that improves thermal cycle performance of CBGAs and plastic BGAs. In one trial, UA-2605 tripled the 0°C to +100°C performance of a CBGA, to nearly 2500 cycles. Previously, an underfill was needed to achieve this level of performance.

Zymet, Inc

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