Industry News: low power (Page 1 of 113)

Frost & Sullivan Lauds Heller Industries' Exceptional Growth Borne of its Advanced SMT Reflow Soldering Equipment for Industry 4.0

Industry News | 2016-06-22 15:33:28.0

Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost & Sullivan recognizes Heller Industries, Inc. with the 2016 Global Frost & Sullivan Award for Growth Excellence Leadership. Heller Industries has made remarkable improvements to its product and technology portfolios over the last 10 years to emerge a top participant in the SMT reflow soldering equipment market.

Heller Industries Inc.

Jetting Pump Configurations Now Available for Integrating into Third Party Dispense Systems.

Industry News | 2016-05-10 14:16:16.0

GPD Global offers individual pumps for integration into your existing platform – the Jetting NCM5000 Pump is one of them. The Jetting NCM5000 Pump simplifies jetting to its basic elements: hammer, pin, and nozzle. Only the pin and nozzle are wetted parts. This means easy set-up, cleaning, and upkeep.

GPD Global

Zarlink Sells Wafer Facility to X-Fab for $30M

Industry News | 2002-03-29 08:28:28.0

Has Found a Buyer for its Wafer Fabrication Facility in Plymouth, England

SMTnet

GPS Receiver Shrinks to Surface Mounting

Industry News | 2003-03-18 10:12:41.0

The Falcom JP7 is a single-board GPS receiver with 12 parallel channels.

SMTnet

Hybrid 3dB Mini SMT Couplers

Industry News | 2003-06-17 08:07:40.0

The Radiall SMT coupler range now includes the new 14.2 x 5.1mm mini type.

SMTnet

Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

SMTnet

Power Connectors Bring Heavy Cables Onboard

Industry News | 2003-05-23 08:24:49.0

Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

More Light from Smaller LEDs

Industry News | 2003-04-23 08:21:34.0

Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.

SMTnet

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