Industry News | 2003-03-11 08:45:00.0
CAMtastic DXP is the latest version of Altium's complete CAM verification and editing system that bridges the gap between PCB design and manufacturing and facilitates communication between board designers, fabrication engineers, and their clients.
Industry News | 2003-03-19 08:25:45.0
Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2020-06-24 15:33:26.0
Registration is now open for IPC E-Textiles 2020 Virtual Summit, to be held Thursday, October 1 and Friday, October 2. IPC E-Textiles 2020 Virtual Summit will consist of two 90-minute interactive educational workshops each day, as well as a live tour of the University of Minnesota Wearable Technology Lab.
Industry News | 2012-10-31 15:53:31.0
B revision of IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies. This important industry standard is a joint effort of IPC — Association Connecting Electronics Industries® and the Wire Harness Manufacturer’s Association (WHMA).
Industry News | 2013-03-26 17:09:31.0
The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that is occurring throughout the electronics industry: more cooperation and information sharing.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
Industry News | 2020-10-04 15:08:41.0
IPC is known for developing addendums to some of its most widely used standards for specific industry sector use, including military/aerospace, space flight, automotive and telecommunications. Now, IPC has responded to requests from the medical device segment of the electronics industry and has released IPC-6012EM,Medical Applications Addendum to IPC-6012E, Qualification and Performance Specification for Rigid Printed Boards.
Industry News | 2011-05-27 23:03:55.0
Two IEEE standards on setting criteria for environmentally preferable electronic equipment will soon be balloted. Although technically voluntary, these standards, under the Environmentally Preferable Electronics Assessment Tool (EPEAT) umbrella of standards, become de facto regulations due to President Obama’s Executive Order 13514 Federal Leadership in Environmental, Energy, and Economic Performance that requires all government procurement to be certified to EPEAT.
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