Industry News: manual for flex 2010 c (Page 1 of 2)

IPC Releases PCB Industry Results for February 2010

Industry News | 2010-03-27 19:35:44.0

BANNOCKBURN, Ill., USA, - IPC — Association Connecting Electronics Industries® announced today the February findings from its monthly North American Printed Circuit Board (PCB) Statistical Program.

Association Connecting Electronics Industries (IPC)

Free Sessions at Electronics Midwest Focus on Best Practices for Manufacturing Electronics of Tommorow

Industry News | 2010-09-13 15:26:59.0

IPC — Association Connecting Electronics Industries® will bring together some of the brightest minds in the electronics industry for three free technical sessions at Electronics Midwest. Held September 28–29, 2010, at the Donald E. Stephens Convention Center, in Rosemont, Ill., the sessions will provide answers and insights into the challenges in printed board fabrication and assembly technologies as well as manufacturing with sustainability in mind.

Association Connecting Electronics Industries (IPC)

Volunteers Honored for Their Contributions to IPC and Industry

Industry News | 2010-04-10 02:37:34.0

IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO™, held April 6–8, 2010 in Las Vegas.

Association Connecting Electronics Industries (IPC)

Nation’s Fastest Growing Electronics Manufacturing Marketplace Gears Up for Electronics Midwest

Industry News | 2010-07-09 18:16:23.0

With recent PCB book-to-bill reports showing positive signs of economic recovery in North America, the timing for building business in the electronics manufacturing industry seems ideal, especially in the Midwest. Helping companies take advantage of the favorable conditions and new industry trends, IPC — Association Connecting Electronics Industries® and Canon Communications have joined forces to produce Electronics Midwest, an exhibition and technical conference for the electronics assembly and printed board design and manufacturing industries.

Association Connecting Electronics Industries (IPC)

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

Essemtec Introduces FLX2010C System with Vacuum Downholder for Flex Board Component Placement

Industry News | 2008-09-08 03:46:39.0

Essemtec AG, a leading manufacturer of surface mount technology production equipment, announces that it has worked with leading suppliers of die bonders to develop a highly economical solution for the efficient placement of special components on film or flex boards, providing many benefits to the users.

ESSEMTEC AG

Altus Enhances Soldering Process for Leading Electronics Manufacturer

Industry News | 2024-03-11 18:17:03.0

In today's rapidly advancing electronics manufacturing landscape, achieving zero defects and maintaining stringent quality control standards throughout production processes are paramount. The precision alignment and attachment of components, particularly with flex circuits, can pose significant challenges that demand innovative solutions.

Altus Group

Professional Solutions for Hot Air SMD Rework

Industry News | 2011-08-24 21:38:06.0

From November 15-18, Finetech will exhibit professional system solutions for hot air SMD rework at the Productronica 2011 show in Munich.

Finetech

Nordson DIMA introduces new inline concept for hot bar bonding and soldering at Productronica 2017

Industry News | 2017-11-08 15:24:31.0

Nordson DIMA, a division of Nordson Corporation (Nasdaq NDSN), will exhibit a range of products at Productronica, the world’s leading trade fair for electronics development and production, to be held in Munich, Germany, on November 14-17, 2017, in Hall A2, stands 345 and 578.

C-Tech Systems, B.V. [formerly Nordson DIMA]

DuPont Circuit & Packaging Materials Introduces Pyralux® TK Flexible Circuit Materials for High Speed and High Frequency Printed Circuit Boards

Industry News | 2010-04-12 16:09:04.0

RESEARCH TRIANGLE PARK, N.C. — DuPont Circuit & Packaging Materials (CPM) introduced its newest high-performance laminate for printed circuit boards. DuPont™ Pyralux® TK flexible circuit material is a copper clad laminate and bonding film system specifically formulated with DuPont™ Teflon® fluoropolymer film and Kapton® polyimide film for high speed digital and high frequency flexible circuit applications. DuPont™ Pyralux® TK delivers the lowest dielectric constant (DK) of any thin laminate and bondply material on the market today.

DuPont

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