Industry News: mashin remove oxidation bga (Page 1 of 1)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTA Ohio Expo & Tech Forum August 4th, 2016

Industry News | 2016-07-30 19:22:36.0

Ascentech LLC will exhibit and demonstrate new test and process optimization instruments and solutions at the upcoming SMTA Ohio Expo & Tech Forum August 4th 2016 in Independence (Cleveland) Ohio.

Ascentech LLC

Ascentech to Exhibit Optilia Inspection, GEN3 Systems Solutions at SMTAI 2016 in Booth #219

Industry News | 2016-09-08 13:43:04.0

Ascentech, LLC will exhibit and demonstrate new test and process optimization instruments and solutions at the upcoming SMTA International Conference and Exhibition in Rosemont, IL, Sep. 25 - 29, 2016. Ascentech will exhibit these new products in booth #219.

Ascentech LLC

MARTIN to Demonstrate Mini-Oven Reball/Solder Bumping Unit at SMTA LA/Orange County Expo

Industry News | 2011-10-07 23:08:54.0

MARTIN will showcase its Mini-Oven Reball/Solder Bumping unit at the upcoming SMTA LA/Orange County Expo & Tech Forum.

MARTIN (a Finetech company)

Ascentech to Introduce Remarkable New INSPECTIS System at Two SMTA Chapter Shows in the Northeast

Industry News | 2016-10-16 19:20:54.0

Ascentech, LLC will be exhibiting at two upcoming SMTA Chapter shows in the northeast, and will introduce a new inspection system as well as exhibit familiar leading test and inspection technologies. Ascentech LLC is a well-known distributor of leading-edge process optimization equipment for electronics manufacturing.

Ascentech LLC

Solder Joint Encapsulant

Industry News | 2015-05-13 14:00:03.0

The evolution of soldering processes in the Microelectronics Industry has made a paradigm shift away from Sn/ Pb to Pb-free. Compounded with advancements in miniaturization, Pb- free soldering's higher re-flow temperature and the nature of solder has resulted in poor reliability relative to: mechanical strength of the solder joint, warpage and thermal cycling performance. In response, YINCAE engineered low temperature solder joint encapsulation adhesives.

YINCAE Advanced Materials, LLC.

Gen3 Systems’ Products to be Displayed by Ascentech LLC at SMTAI in Booth #219 and at the Special SMTAi Feature Area

Industry News | 2015-09-30 16:26:02.0

Gen3 Systems Limited will exhibit both GEN3 Systems’ products and Optilia Inspection equipment in Booth #219 at the SMTA International Conference and Exhibition, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. Ascentech LLC also will participate in the SMTA International – National Physical Laboratory (NPL) Defect Database Live Solder Paste and Solder Joint Automatic Inspection Experience on the show floor. The experience is free to attend and is supported by CIRCUITS ASSEMBLY Magazine, SMTA and NPL.

Gen3 Systems

NEW RF CENTER PROBE TEST SOCKET FOR DEVICES

Industry News | 2004-09-29 21:38:11.0

Frenchtown, NJ, September 2004

Aries Electronics Inc

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