Industry News: membrane switches (Page 1 of 2)

Hong Kong Membrane Circuit to Combine Membrane Switches with Flexible PCBs

Industry News | 2003-02-13 08:37:07.0

A Product Incorporating this Technology can be Loaded with More Features

SMTnet

Printed Electronics Coming of Age at IPC APEX EXPO 2012

Industry News | 2012-02-07 00:51:20.0

A key enabling technology that is making a significant impact in consumer, commercial, medical and specialty electronics markets, printed electronics is coming of age at IPC APEX EXPO®, February 28-March 1, 2012, at the San Diego Convention Center. IPC APEX EXPO will feature a dedicated printed electronics area on the show floor, a printed electronics track in the technical conference, and historic standards development meetings where the first-ever industry requirements for the manufacture and assembly of printed electronics will be discussed and developed.

Association Connecting Electronics Industries (IPC)

LEADING ELECTRONICS MANUFACTURING ENGINEERS TO CONFER ON CRITICAL INDUSTRY STANDARDS AT IPC APEX EXPO

Industry News | 2014-02-21 16:59:49.0

IPC APEX EXPO® will advance many of the standards the PCB manufacturing and assembly industries rely on when it hosts more than 90 standards development committee meetings, March 23–27, 2014, at the Mandalay Bay Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

ALMAX EIS Triples Prototype Membrane Switch Manufacturing Capacity

Industry News | 2015-07-16 14:05:24.0

July 15, 2015 – Kirkland, WA: ALMAX EIS has increased its quick-turn capacity for prototype membrane switches. New equipment at their Shenzhen manufacturing facility has made it possible to ship quick-turn membrane switches in five days at lower off-shore prices.

ALMAX EIS

Plexus Gives ALMAX EIS Highest Supplier Ratings

Industry News | 2015-10-06 16:25:55.0

Plexus rated ALMAX EIS as a top scoring supplier for all three of their partner ranking criteria: quality, delivery and paperwork.

ALMAX EIS

New Henkel Electrically Conductive Adhesive Cures Fast at Low Temperature; Ideal for Photovoltaic, Automotive and Membrane Switch Applications

Industry News | 2010-05-12 13:12:33.0

Delivering a robust alternative to high-temperature solder processes, Henkel has developed Hysol ECCOBOND CA3556HF, a silver-filled electrically conductive adhesive designed to offer fast cure at low temperature. The material is ideal for high-throughput production processes and applications that dictate high peel strength, such as the assembly of photovoltaic (PV) modules, automotive sensors and membrane switches that incorporate temperature-sensitive substrates.

Henkel Electronic Materials

MicroScreen Receives ITAR Registration

Industry News | 2009-06-12 07:21:12.0

MicroScreen LLC today announced they have received their official International Traffic in Arms Regulations (ITAR) registration from the U.S. Department of State, Bureau of Political-Military Affairs.

MicroScreen, LLC

Engineered Conductive Materials Appoints EMJS Tech, Inc. to Represent Its Sol-Ag Line of Conductive Adhesives and Grid Inks in Korea

Industry News | 2011-07-13 15:01:14.0

Engineered Conductive Materials announces that EMJS Tech, Inc. will represent its Sol-Ag line of conductive adhesives and grid inks throughout Korea.

Engineered Conductive Materials, LLC

PNC Adds VT-901 to Its Approved Material Listing

Industry News | 2012-03-17 22:32:21.0

PNC, a Nutley New Jersey manufacturer of printed circuit boards, is pleased to announce the addition of Ventec’s VT-901 250Tg Polyimide to their internal approval and UL listing. This IPC4101C/42 addition will allow PNC to expand their offerings to its customers with commercial high operating temperature, high reliability, and military specifications and those with power supply and aerospace designs. PNC’s sustained growth in the high reliability market segments drives its continual addition of proven quality substrates to its qualified products list. The addition of this new product to its many other approved high performance base materials broadens the manufactured PCB solutions from both its US based manufacturing facility and through its offshore UL approved partner.

PNC Inc.

PNC Secures Ventec Polyimide Qualification

Industry News | 2013-03-27 15:21:59.0

PNC Inc. is proud to announce its latest UL qualification of polyimide base materials. PNC has partnered with Ventec USA using VT-901 laminate and VT-901PP prepreg. These high-temperature, high-reliability products expand PNC’s wide product offering and introduces the manufacturer into new industries at a new competitive level. The qualification includes 0.002” inner layer cores and a minimum overall board thickness stack up of 0.025”. The qualification also includes a minimum outer layer copper thickness of half ounce copper while inner layer maximum is two ounce copper.

PNC Inc.

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