Industry News | 2018-12-13 03:35:05.0
Pick And Place Machine
Industry News | 2018-01-24 22:13:50.0
Kurtz Ersa North America today announced plans to exhibit in Booth #1337 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The Ersa team will highlight a lineup of advanced reflow, selective solder and rework equipment, including its VERSAPRINT 2 Ultra stencil printer, VERSAFLEX-Ultra selective solder module and IR/PL 650 XL rework system.
Industry News | 2024-02-26 14:00:02.0
High-performance memory supplier chooses Saki's 3Si solder-paste inspection and 3Di inline AOI systems to handle miniaturization challenges and prepare for smart manufacturing.
Industry News | 2021-06-30 04:21:06.0
Takaya's APT-1600FD-SL Dual Sided Flying Probe test system for assembled PCBAs delivers both high speed and a larger testing area designed to accommodate large PCBAs for the emerging markets of 5G communications and BMS (Battery Management System) applications. The "-SL" series provides a 48% larger test area, which aligns perfectly with applications including semi conductor test probe card manufacturers. These customers urged Takaya to increase the test area of their dual-sided system.
Industry News | 2024-02-05 13:55:07.0
Gen3 is excited to announce its participation in the Southern Manufacturing & Electronics Expo, taking place Feb. 6-8, 2024 at the Farnborough International Exhibition Centre. GEN3 will be exhibiting a range of innovative products, including MEK's JDz650 inline and Desktop Verispector AOI systems, MBTech's N29 SA4 Stencil Cleaning Equipment, and the GEN3 AutoSIR2+ and NEW CM Series.
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