Industry News: minimum smt pcb thickness for bgas (Page 5 of 8)

SMT China Magazine Awards Nordson YESTECH for FX-940 AOI System with 3D Capability at NEPCON China

Industry News | 2015-04-21 16:12:41.0

Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-AOI for its FX-940 Automated Optical Inspection (AOI) In-line PCB inspection system. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.

Nordson YESTECH

GKG Asia Receives Coveted TÜV SÜD Certification for Its GL Printer

Industry News | 2014-12-02 13:32:31.0

GKG Asia Pte Ltd, a leading supplier of fully automatic vision printers, announces that the GL printer is now TÜV SÜD certified for both the United States and Canada.

GKG Asia Pte Ltd

Essemtec Provides Easy Programming for Flexible Small Batch/ Prototype/ NPI Assembly

Industry News | 2014-05-01 07:47:51.0

Not only the placement speed, but the flexibility of component parts and PCB formats, as well as the ease of programming and the reliability of the assembly from lot size 1 are the decisive criteria for small batch/ prototype production.

ESSEMTEC AG

Hanwha Techwin Wins TWO GLOBAL Technology Awards for LED Production Equipment and Placement – High Volume

Industry News | 2021-11-22 08:31:08.0

Hanwha Techwin Automation Americas is pleased to announce that it received two 2021 GLOBAL Technology Awards in the categories of LED Production Equipment and Placement – High Volume for its HM520h Hybrid LED Mounter. The awards were announced during a ceremony that took place Tuesday, Nov. 16, 2021 during productronica in Munich, Germany.

Hanwha Techwin CO., LTD.

Your Guide to Process Defect of the Month

Industry News | 2016-08-19 05:00:52.0

If you have a process problem, let NPL Defect of the Month Video help you team

ASKbobwillis.com

Photo Stencil Presents "Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly" at IWLPC 2015

Industry News | 2015-10-11 16:19:40.0

Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.

Photo Stencil LLC

Z-AXIS Adds $1.2M in Equipment for Printed Circuit Board and Cable Assembly Services

Industry News | 2021-09-24 13:31:07.0

Investments over the past 18 months support continuing technology advancements and business growth at the electronics design and contract manufacturing center near Rochester, NY

Z-AXIS, Inc.

Practical Components Expands Product Offering with SMTA Solder Paste Test Vehicle for Miniaturized SMT Optimize the stencil printing and reflow portions of SMT assembly with this SMTA test vehicle.

Industry News | 2019-04-03 20:07:41.0

Practical Components is a leading international distributor of mechanical IC samples or “dummy” components that has added a new SMTA Solder Paste Test Vehicle for Miniaturized Surface Mount Technology (SMT) to its array of Dummy Components, Solder Training Kits and PCB Evaluation Kits.

Practical Components, Inc.

SHENMAO Picks up Award for New Low Temperature Solder at SMTA Guadalajara

Industry News | 2019-10-24 16:29:44.0

SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.

Shenmao Technology Inc.

ESSEMTEC to Debut New Placement Machine for Small and Mid-Size Production at APEX 2008

Industry News | 2008-03-12 16:25:33.0

Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the PANTERA-XV SMD placement system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.

ESSEMTEC AG


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