Industry News: mirtec component offset (Page 1 of 11)

Hong Kong Membrane Circuit to Combine Membrane Switches with Flexible PCBs

Industry News | 2003-02-13 08:37:07.0

A Product Incorporating this Technology can be Loaded with More Features

SMTnet

November 11-17 2021 Online Equipment Auction

Industry News | 2021-11-08 09:27:12.0

Baja Bid will be liquidating excess and unused assets via online auction. The bidding for this event will open promptly at 8:00am EST on November 11th and the closing will begin at 1:00 pm EST on November 17th.

Baja Bid

Now Bidding - Online PCB Assembly Equipment Auction

Industry News | 2021-11-11 10:56:53.0

Baja Bid is liquidating excess and unused assets from CASE Assembly via online auction. The bidding for this event is now open and the closing will begin at 1:00 pm EST on November 17th, 2021.

Baja Bid

Online Equipment Auction Closing Today

Industry News | 2021-11-17 09:28:16.0

Baja Bid is hosting an online auction event featuring surplus equipment from CASE Assembly. Universal Instruments, DEK, Heller and much more. The bidding period will begin closing today at 1pm EST.

Baja Bid

Baja Bid Hosts Another Successful Online SMT Exchange Auction, and Announces Future Events to Come

Industry News | 2013-09-16 13:58:19.0

Baja Bid has wrapped up another series of auctions, selling used SMT equipment in August to various bidders around the world.

Baja Bid

New Details Were Just Announced for Upcoming Baja Bid SMT Online Exchange Auction

Industry News | 2013-10-02 14:39:35.0

Baja Bid announced its latest event which features quality used equipment at discounted prices for the electronics manufacturing industry.

Baja Bid

IPC Offers Technical Education Course, Designing Boards with HDI Technology, at PCB Carolina

Industry News | 2018-07-10 20:52:09.0

High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.

Association Connecting Electronics Industries (IPC)

A Look to the Future in the Electronics Industry at IPC APEX EXPO® 2013

Industry News | 2013-01-19 07:46:16.0

Information that inspires innovation is center-stage for design, printed boards, electronics assembly, test and printed electronics

Association Connecting Electronics Industries (IPC)

MIRTEC to Exhibit Award-Winning AI-Based 3D AOI Technology at SMTA International 2024

Industry News | 2024-09-23 20:44:02.0

MIRTEC is excited to announce its participation in the highly anticipated SMTA International 2024, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. MIRTEC will proudly showcase its groundbreaking MV-6 OMNI 3D AOI Series featuring the exclusive OMNI-VISION® 3D Inspection Technology in Booth #2834.

3M Electrical Solutions Division

MIRTEC RECEIVES PRESTIGIOUS EM ASIA INNOVATION AWARD FOR ITS TECHNOLOGICALY ADVANCED MV-9 3D AOI SERIES

Industry News | 2012-04-26 21:17:09.0

“The Global Leader in Inspection Technology”, announces that it has been awarded the 2012 EM Asia Innovation Award in the category of Test & Measurement / Inspection Systems – AOI for its revolutionary MV-9 3D AOI Series.

Finetech

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