Industry News: mosfet soldering (Page 1 of 2)

Vishay Offers Designers Free Online MOSFET Thermal-Simulation Tool

Industry News | 2007-02-14 15:40:22.0

New ThermaSim Is First Online Simulation Tool to Use Finite Element Analysis Models for Increased Accuracy

Vishay Intertechnology, Inc.

Vishay�s New Common-Drain MICRO FOOT� Power MOSFETs Offer On-Resistance Comparable to TSSOP 8 Devices in 81% Smaller Chipscale Package

Industry News | 2004-08-09 16:13:02.0

Two new common-drain, chipscale power MOSFETs that are the industry�s first such p-channel and 30-V n-channel devices were announced today by Siliconix incorporated.

Vishay Intertechnology, Inc.

New Yorker Electronics Announces 12 new 1200V Hyperfast and Ultrafast Rectifiers from Vishay

Industry News | 2020-12-29 19:46:07.0

New Ultrafast Rectifiers Feature Unique Combination of Low Conduction and Switching Losses

New Yorker Electronics

New PDI Watertight Power Stanchion Series is designed for Harsh & Rugged Environments

Industry News | 2020-12-29 19:48:43.0

Ultra Durable Preassembled Power Distribution Equipment offering Single or Multiple Mechanical Interlocks

New Yorker Electronics

New LITTLE FOOT� Plus Driver Products for High- and Low-Side DC-DC Operation Integrate MOSFETs and Drive Circuitry in 10-mm by 6.2-mm Footprint

Industry News | 2003-06-11 13:37:07.0

With efficiencies better or comparable to competing implementations in the MLF/QFN/Power Block packages, these new devices in the LITTLE FOOT SO 16 feature a 38% or smaller standard footprint, simplifying design, assembly, soldering, and layout.

Vishay Intertechnology, Inc.

Tresky presents metallic sintering for power electronics at productronica 2023

Industry News | 2023-10-30 19:21:14.0

Tresky GmbH from Hennigsdorf near Berlin will present various metallic pre-sintering processes, including the Die Transfer Film (DTF) process, at this year's productronica 2023 in Munich. Especially for bonding semiconductors such as IGBTs, SiC MOSFETs or GaN HEMTs with Ag on DBC or AMB substrates or for connecting power modules on heat sinks, metallic sintering offers a high-performance solution with maximum reliability.

Tresky AG

Practical Components Adds Casio Micronics WLP Wafer Scale Technology to Dummy Component Lineup

Industry News | 2011-01-11 13:37:34.0

Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (WLP) to its comprehensive line of dummy components. The WLP is a miniature package, suitable for installation in surface mount technology (SMT).

Practical Components, Inc.

Why do we pay attention to IGBT?

Industry News | 2019-12-14 01:05:17.0

IGBT is the core device of energy conversion and transmission and the "CPU" of power electronic devices. Using IGBT for power transformation can improve the efficiency and quality of electricity use, and is featured by high efficiency, energy saving and green environment protection. It is the key supporting technology to solve the problem of energy shortage and reduce carbon emission.

Beijing Technology Company

New Yorker Electronics Releases new Vishay Dale High Temperature Thin Film Resistors

Industry News | 2020-12-10 14:12:04.0

High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability

New Yorker Electronics

New Vishay Dale Thin Film Wraparound Chip Resistor is released by New Yorker Electronics

Industry News | 2021-09-15 10:52:35.0

Vishay Precision Performance Resistor Series Significantly Reduces Board Space and Component Counts by Replacing Larger Resistors

New Yorker Electronics

  1 2 Next

mosfet soldering searches for Companies, Equipment, Machines, Suppliers & Information