Industry News | 2003-06-03 08:20:48.0
Designed for fast and easy DIN-rail mounting
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2014-09-18 18:22:57.0
FCT Assembly introduces the A-Laser Division’s new laser direct structuring (LDS) capability. The introduction of laser direct structuring (LDS) has revolutionized the molded interconnect device (MID) market, bringing flexibility to design, enhancing product capability and often at a significant cost savings.
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