Industry News | 2021-04-08 04:38:27.0
MIRTEC received a 2021 CIRCUITS ASSEMBLY NPI Award in the category of Test and Inspection – AOI for its MV-6Z OMNI 3D In-Line AOI system. The award was announced during a special online awards ceremony on Tuesday, April 6, 2021.
Industry News | 2011-11-20 12:31:32.0
MIRTEC, "The Global Leader in Inspection Technology", has been awarded a Global Technology Award in the category of Inspection Equipment - AOI for its MV-7 2D/3D In-Line AOI Series.
Industry News | 2003-06-12 08:24:37.0
An adaptive tool prevents small and/or light components "lifting" or "floating" on printed circuit board assemblies during the wave solder process.
Industry News | 2018-08-21 14:28:35.0
Clariant's new Humitector Type 2 Non-Reversible Humidity Indicator Cards contain a patent-pending non-reversible 60% humidity spot indicator which enables them to indicate whether dry packed surface mount devices (SMDs) have been exposed to high levels of moisture at any point during shipment or storage. This unique innovation offers a major step forward in preventing moisture-compromised surface mounts from entering production.
Industry News | 2018-06-13 12:52:51.0
Market's first non-reversible humidity indicator Card Type 2 is low-halogen and cobalt-dichloride-free. Complies with the latest revision of IPC/JEDEC standard, J-STD-033D.
Industry News | 2024-01-16 03:45:38.0
Discover efficiency with I.C.T's Intelligent SMD Storage. Streamline processes, optimize space, and elevate SMT production globally. Explore now!
Industry News | 2016-12-02 15:47:10.0
BGA Rework Process Implementation
Industry News | 2003-04-17 11:35:44.0
Honored for their contributions to IPC and the electronics industry
Industry News | 2023-08-01 03:54:42.0
The aerospace industry has been a driving force behind technological innovation, with its advanced technologies finding increasing applications in other fields. This article explores how aerospace technology is employed in Surface Mount Technology (SMT) and Through-Hole Technology (THT) devices, ushering in new development opportunities for the electronics manufacturing sector.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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