Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2003-01-24 09:07:53.0
For Industrial, Telecom and Datacom Use
Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2003-03-14 09:03:48.0
Sarantel has developed a surface-mount version of its active GeoHelix miniature GPS antenna.
Industry News | 2022-08-14 14:18:23.0
The following statement is issued by John Mitchell, IPC president and CEO, to comment on President Biden's signature today on the "CHIPS and Science Act" in Washington, D.C.:
Industry News | 2015-02-18 14:38:15.0
IPC's Validation Services Program has awarded an IPC J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML) to John Deere Electronic Solutions, a manufacturer of custom, integrated electronics components based in Fargo, N.D. The company became the first OEM to successfully complete an intensive audit based on two of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies.
Industry News | 2020-09-22 11:01:36.0
IPC and Power Sources Manufacturers Association (PSMA) have signed a Memorandum of Understanding (MoU) pledging to build a strong complementary relationship between the two entities with a focus on standards development, education and training.
Industry News | 2024-10-13 18:41:25.0
New white paper serves as a blueprint for strengthening PCB assembly capabilities in the United States
Industry News | 2003-04-29 07:30:06.0
Announce their plans to co-sponsor a free online conference on the current state of bare die packaging
Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
