Industry News | 2012-03-07 19:42:26.0
IPC bestowed its highest corporate honors to DDi Corp. and Flextronics. During luncheons held in conjunction with IPC APEX EXPO®, IPC awarded the IPC Peter Sarmanian Corporate Recognition Award to DDi Corp. and the IPC Stan Plzak Corporate Recognition Award to Flextronics. For many years, both DDi Corp. and Flextronics have consistently provided staff resources to standards development and other committee initiatives.
Industry News | 2012-03-28 17:53:21.0
IPC announces the appointment of John W. Mitchell as its new president and CEO,
Industry News | 2018-10-18 08:42:00.0
Reflow oven zone temperature set up and thermal profile
Industry News | 2013-10-01 18:16:06.0
A dozen experts from organizations in Asia, Europe and North America will present strategies for enhancing reliability in electronics assemblies on 19–20 November in Bangkok.
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2011-10-08 17:54:35.0
IPC is seeking an outstanding individual to become its next president and chief executive officer (CEO). The candidate will succeed current CEO Denny McGuirk, who leaves on November 3 to become president of SEMI, the global industry association serving the nano- and microelectronics manufacturing supply chains.
Industry News | 2022-03-14 08:04:11.0
In recognition and acknowledgment of their extraordinary contributions to the Wiring Harness Manufacturer's Association (WHMA) and the cable and wire harness industry, four long-time WHMA members were presented with coveted WHMA awards. Two WHMA Hall of Fame and two WHMA Volunteer Excellence Awards were presented at WHMA's 29th Annual Wire Harness Conference on February 16.
Industry News | 2009-07-24 14:13:44.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the program for their co-organized 2009 Medical Electronics Symposium: Drivers for Technology, Health and the Economy on September 16-17, 2009 at Arizona State University, Tempe, AZ. This two day program will cover a broad spectrum of medical applications with Day 1 focusing primarily on the chip level component packaging and Day 2 focusing on board assembly and systems levels.
Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
