Industry News | 2010-07-22 22:37:02.0
IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.
Industry News | 2005-02-17 09:43:45.0
STOCKHOLM, Sweden, Feb 14, 2005
Industry News | 2008-11-18 17:22:43.0
Moulded Interconnected Device (MID) applications are the current focus of the automotive and medical device industries. In such products, circuits are directly applied onto the surface of injection moulded plastic parts or are integrated as part of products. In a 3D-MID, SMD components typically are on multiple levels. Essemtec has developed a system that can dispense and place in three dimensions and is capable of placing 3D-MID technology.
Industry News | 2009-11-11 12:57:53.0
At Productronica 2009 MYDATA shows SMT manufacturers how to save substantial time in production with MYDATA solutions - specifically designed with lean manufacturing in mind. With unique machine concepts and advanced software tools MYDATA presents the intelligent factory of the future.
Industry News | 2008-11-24 20:30:14.0
Small batches and prototypes of SMD assembled boards can be mounted quickly and accurately using the Essemtec pick-and-place system � EXPERT-SAFP. Layout data and the bill of material can be imported directly into the machine, which guides the operator through the placement program. The pick-and-place head is air suspended, moves gently and is ergonomic, allowing for fast and accurate work.
Industry News | 2009-08-13 15:33:00.0
Universal Instruments introduces a ground-breaking shop floor control software. It maximizes line utilization and provides unprecedented visibility into production.
Industry News | 2008-04-07 19:18:42.0
Essemtec announces it will introduce the Semiautomatic SMT Prototyping System, EXPERT in distributor -------- booth ------ at the upcoming NEPCON China/EMT China 2008 exhibition and conference - scheduled to take place April 8-11, 2008 in Shanghai, PR China.
Industry News | 2008-02-29 16:13:23.0
Glassboro, NJ � Essemtec, a leading manufacturer of surface mount technology production equipment, announces that it will debut the FLX2010-BLV SMD pick-and-place system in booth 501 at the upcoming APEX 2008 exhibition and conference, scheduled to take place April 1-3, 2008, in Las Vegas.
Industry News | 2017-03-29 07:39:45.0
Electronics Manufacturing Services Provider Invests in Upgraded 3D Inspection of Printed Circuit Board Assemblies.
Industry News | 2011-08-03 21:32:16.0
Cognex Corporation has introduced its next-generation wafer identification (ID) reader and accompanying software, the In-Sight® 1740 series and In-Sight Explorer Wafer ID software version 4.5.0.
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
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