Industry News | 2015-10-21 19:45:39.0
Sono-Tek Corporation (OTC BB: SOTK) will highlight the QR Impact Jet on the SonoFlux ultrasonic spray fluxer in Hall A4, Booth 141 at the productronica International Trade Fair, scheduled to take place Nov. 10-13, 2015 at the Messe München exhibition center in Munich, Germany. The Impact atomizing assembly is used in both the SonoFlux Servo and SonoFlux EZ system and incorporates an air deflector that drives the flux droplets to the PCB for maximum top side fill and unsurpassed through-hole penetration.
Industry News | 2018-07-08 18:45:56.0
SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.
Industry News | 2003-04-07 13:08:13.0
Cookson Electronics Equipment Announces Camalot XYFLEXPRO Microdot Dispensing Capabilities
Industry News | 2018-10-17 20:13:20.0
SHENMAO America, Inc. is pleased to announce that it was awarded a 2018 Global Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Oct. 16, 2018 ceremony that took place during SMTA International.
Industry News | 2018-11-16 16:38:33.0
SHENMAO America is pleased to announce that it was awarded a 2018 Mexico Technology Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Wednesday, Nov. 14, 2018 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2019-01-30 08:42:31.0
SHENMAO America, Inc. is pleased to announce that it was awarded a 2019 NPI Award in the category of Flux for its SM-862 Liquid Flux. The award was presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2019-05-27 21:16:27.0
SHENMAO America, Inc. introduces PW215 Water Soluble Solder Paste, ideal for SMT and IC packaging applications. With a wide reflow window, this water soluble solder paste can effectively fit into the design process for even the most complex SMT or IC assembly substrate designs.
Industry News | 2020-12-01 02:52:15.0
SHENMAO America, Inc. is pleased to introduce its Joint-Enhanced Solder Paste (JEP) PF606-EP Series. JEP offers the advantages of both traditional solder paste and anisotropic conductive paste.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2022-06-24 10:13:15.0
SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.
