Industry News | 2011-06-16 15:01:31.0
Kyzen announces that Dr. Mike Bixenman will host an upcoming IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011 from 10-11 a.m. CST.
Industry News | 2011-07-26 21:41:43.0
Kyzen announces that Dr. Mike Bixenman hosted an informative IPC Webinar titled “Cleaning Highly Dense Circuit Assemblies and Advanced Packages” on Tuesday, July 19, 2011.
Industry News | 2012-09-18 14:01:32.0
AIMwill present a paper titled “VOC-free Flux Study: Not All Weak Organic Acids Are the Same” at the upcoming PCB West Conference & Exhibition
Industry News | 2018-07-02 21:54:56.0
SHENMAO America, Inc. is pleased to introduce the PF606-P245 New Generation Lead-free Zero Halogen Solder Paste. The paste provides continuous high-speed printability that produces superior solder paste print quality as well as a wide reflow process window for excellent solderability.
Industry News | 2022-07-31 19:42:04.0
KYZEN will exhibit at the SMTA Chihuahua Expo & Tech Forum, scheduled to take place Thursday, Aug. 25, 2022 at the Sheraton Chihuahua Soberano in Chihuahua, Mexico. The KYZEN team will showcase the award-winning KYZEN® E5631 and E5631J Next Generation Stencil Cleaners as well as CYBERSOLV C8882.
Industry News | 2008-02-22 16:14:12.0
GREELEY, CO � February 22, 2008 � FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.�s SN100C product line, presents the NL900 No-Clean Lead-Free Solder Paste.
Industry News | 2016-02-11 13:36:43.0
Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.
Industry News | 2016-04-06 12:15:05.0
Indium Corporation will feature its halogen-free Indium8.9HF no-clean solder paste series at SMT Hybrid Packaging 2016 on April 26-28 in Nuremberg, Germany.
Industry News | 2016-04-12 13:29:35.0
Indium Corporation announces the release of Indium10.2HF, a halogen- and Pb-free, no-clean solder paste that is specifically formulated to address in-circuit testing challenges. Indium10.2HF provides low cost-of-ownership to PCB assemblers through all-around balanced performance.
Industry News | 2021-03-02 14:45:26.0
SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.
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