Industry News | 2010-10-06 14:44:35.0
Helping electronics manufacturing companies train their staff to enhance product quality and increase efficiency, IPC — Association Connecting Electronics Industries® has released a new educational video, DVD-18C, Soldering Terminals. The 37-minute video covers industry best practices for soldering wires to commonly used terminals in accordance with the latest IPC-A-610E and J-STD-001E acceptance standards.
Industry News | 2011-01-20 13:54:40.0
IPC will host the IPC Conference on HDI: Strategies for the 21st Century on March 1–2, 2011, at the National Electronics Museum in Baltimore, Md. Sponsored by Northrop Grumman Corporation, the two-day event includes technical workshops on March 1 and a full-day technical conference on March 2.
Industry News | 2011-04-29 17:28:45.0
Celebrating the best of electronic interconnection research being conducted by both industry leaders and academia, IPC announced the 2011 Best Industry Posters and the winners of the IPC Academic Poster Competition at IPC APEX EXPO, held April 12–14, 2011 in Las Vegas.
Industry News | 2011-09-28 14:21:48.0
IPC Midwest Conference & Exhibition, held last week, proved that a regional event can be a win-win for all facets of the electronics manufacturing industry.
Industry News | 2012-06-01 13:55:57.0
As chip speeds skyrocket and system sizes diminish, designers and manufacturers face new and complex challenges
Industry News | 2012-06-23 10:33:03.0
IPC – Association Connecting Electronics Industries® announces that IPC APEX EXPO® has been named one of the Trade Show News Network 2012 “Top 25 Fastest-growing Trade Shows in Attendance in the United States.”
Industry News | 2013-03-26 17:09:31.0
The recently released 2013 IPC International Technology Roadmap for Electronic Interconnections marks a shift that is occurring throughout the electronics industry: more cooperation and information sharing.
Industry News | 2013-05-20 16:19:35.0
IPC – Association Connecting Electronics Industries® has teamed up with PCB Libraries, Inc.
Industry News | 2014-01-21 18:29:32.0
SMTA and Chip Scale Review magazine, co-organizers of the International Wafer-Level Packaging Conference (IWLPC), announced the Best of Conference papers from the event held November 5-7, 2013 in San Jose.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.