Industry News: p-e (Page 1 of 2)

SMTA International to Hold Alternate Alloys Sessions

Industry News | 2011-08-30 19:41:37.0

The SMTA announced two sessions on Alternate Lead-Free Alloys featured during their annual conference, SMTA International, taking place October 16-20, 2011 in Ft. Worth, Texas.

Surface Mount Technology Association (SMTA)

AIMS Harsh Environments Symposium To Address Thermo-Mechanical Analysis, Metallization, and Reliability of Lead-Free Solders

Industry News | 2011-07-14 11:02:39.0

The SMTA announced that the AIMS Harsh Environments Symposium will be held on October 17, 2011 as a focused symposium at SMTA International in Ft. Worth, TX.

Surface Mount Technology Association (SMTA)

Best Papers from SMTA International Announced

Industry News | 2021-02-05 09:31:21.0

The SMTA is pleased to announce the Best Papers from SMTA International 2020. The winners were selected by members of the conference technical committee. For these exceptional achievements, a cash award and plaque are given to primary authors of all winning papers.

Surface Mount Technology Association (SMTA)

SMTA "Members of Distinction" Awards Announced

Industry News | 2021-09-16 06:18:41.0

The SMTA is proud to honor the 2021 "Members of Distinction" award recipients who have shown exceptional dedication to the association and the electronics manufacturing industry.

Surface Mount Technology Association (SMTA)

PennEngineering® Awarded U.S. Patent for Panel Fastener with Hold-Down Ring

Industry News | 2015-07-06 15:10:36.0

PennEngineering® has been awarded U.S. Patent No. 9,051,956 for a panel fastener featuring a hold-down ring, which enables the fastener’s integral screw to be held in its extended position for easy pick-and-place installation during the surface mount assembly process. The inventor of the patented fastener, Brian Bentrim, P.E., serves as Director of Global New Product Development and Quality at the Company. The patent is also currently pending in other regions globally.

PennEngineering

New Yorker Electronics Delivers Advanced New 96-Layer 3D NAND Flash Storage from Innodisk

Industry News | 2021-01-05 10:57:10.0

The Innodisk 3TE7 and 3TG6-P Utilize Industrial-Grade 3D TLC NAND from Toshiba with a 3000 P/E Cycle Number for Increased Endurance

New Yorker Electronics

BTU International Experts to Present at ICACC

Industry News | 2014-01-24 15:58:03.0

BTU International will exhibit in booth #115 at the 38th International Conference and Expo on Advanced Ceramics and Composites (ICACC), scheduled to take place January 26-31, 2014, in Daytona Beach, FL. Ramesh Peelamedu, PhD., senior research scientist at BTU, will present a paper titled "An Industrial Microwave (Hybrid) System for In-Line Processing of High Temperature Ceramics" that he co-authored with Donald A. Seccombe Jr., P.E.

BTU International

BTU to Present at the 39th Conference & Expo on Advanced Ceramics & Composites

Industry News | 2015-01-15 15:17:33.0

BTU International will present at the 39th International Conference and Exposition on Advanced Ceramics and Composites (IACC), scheduled to take place Jan. 25-30, 2015, at the Hilton Daytona Beach Resort and Ocean Center in Daytona Beach, FL. Ramesh D. Peelamedu, Ph.D., and Donald A. Seccombe Jr., P.E., co-authored and will present the paper entitled “Performance Study of Li-Ion Battery Electrodes Dried Using Inline Microwave Hybrid System.” BTU will also exhibit in booth number 307 at the show.

BTU International

STI’s Jim Raby Held Successful Presentation at SMTAI 2009

Industry News | 2009-10-13 16:29:26.0

MADISON, AL — October 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E. held a successful presentation at SMTA International. The presentation was held during session ET3 titled, “System in Packaging (SiP),” which took place Monday, October 5, 2009 from 1-2:30 p.m. in the California room at The Town and Country Resort and Convention Center in San Diego.

STI Electronics

STI’s Engineering Experts to Present at SMTAI 2009

Industry News | 2009-09-17 14:35:25.0

MADISON, AL — September 2009 — STI Electronics Inc., a full service organization providing training, electronic and industrial sales and distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Jim D. Raby, P.E., Mark McMeen, V.P. of Engineering Services, and Casey H. Cooper, Electrical Engineering Manager will give a presentation titled “Imbedded Die Assembly Process, Is It Ready Yet?” at the upcoming SMTA International, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego. The presentation will be held during session ET3 titled, “System in Packaging (SiP), which is scheduled to take place Monday, October 5, 2009 from 1-2:30 p.m. in the California room.

STI Electronics

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