Industry News | 2016-11-21 16:42:03.0
Altus Group is now offering its customers in the UK and Ireland GPD Global's automated dispense systems which in response to customer demand, now have an integrated Pick & Place capability.
Industry News | 2009-09-03 12:06:15.0
SMTA China announces that it presented awards for seven papers at the SMTA China South 2009 Conference Award Presentation Ceremony, held on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter Annual Breakfast Reception.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2002-10-28 12:44:47.0
Ultrasonic Cleaning of Wave Solder and Reflow Pallets
Industry News | 2004-10-21 04:01:52.0
effective protection for electronic components
Industry News | 2012-02-15 20:26:28.0
Kyzen had introduced a new and improved product for cleaning pallets and maintenance applications.
Industry News | 2016-09-14 17:40:09.0
Glide-Line™ introduces Glide-Line 360 conveyor system. The Glide-Line 360 is a combination of powered timing belt based conveyors working together with our family of devices to accomplish almost any type of movement (orientation change, sort, or shift) for your product in a very small space.
Industry News | 2010-06-21 16:04:54.0
Demonstrating its extensive knowledge base for today’s demanding back-end wafer level processes, DEK’s presence at the upcoming Semicon West event in San Francisco, California will feature the Galaxy print platform with Wafer Transport Solution. This system, displayed alongside the CHAD WaferMate 300-1, is configured with a precision wafer pallet and high-performance transport rails, ensuring the accuracy and stability required for DEK’s established and emerging cost-effective Wafer Level Packaging (WLP) applications.
Industry News | 2009-08-04 16:28:40.0
2 @ +/- 12.5µm and advanced speed and acceleration control to ensure robust processing of today’s delicate wafer products.
Industry News | 2019-11-05 22:16:43.0
Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.
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