Industry News | 2020-01-06 16:06:59.0
MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1900 at the 2020 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 4-6, 2020 at the San Diego Convention Center.
Industry News | 2023-09-25 14:05:43.0
MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2003-05-08 07:11:45.0
InDigiNet Signs Definitive Commitment Letter With UBC To Acquire 2.5million in Assets and business Interests plus revenues of Universal Broadband Communications.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
Industry News | 2023-09-20 14:28:04.0
Separating skip scored V-Scored PCB panels up to 48" long is made simple and easy with the K4000 PCB depanelizer from FKN Systek. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable.
Industry News | 2014-02-13 23:58:33.0
Nordson ASYMTEK introduces the Quantum™ Q-6800 high-performance, large-format dispensing system for SMT, PCB packaging, and microelectronics assembly applications. Quantum’s dispense area of 423 x 458 mm handles a wide range of substrate sizes and is large enough so the dispense area isn’t compromised even with dual valve configurations, enabling flexibility in the dispensing process.
Industry News | 2017-07-18 13:16:28.0
Depanelizing skip routed PCB panels up to 48" long is made simple and easy with FKN Systek’s K4000 PCB singulator. Just place the bottom scoreline of the PCB onto the linear blade and step on a guarded foot switch to bring the circular blade across the top scoreline for clean separation of the PCB panels. Right and left blade guards assure operator safety. The front and back support and take up table are height adjustable.
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2012-04-21 08:45:42.0
Count On Tools Inc. (COT), a leading provider of precision components and SMT spare parts, introduces the new ezLOAD flex PCB Support System
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
3 Morse Road 2A
Oxford, CT USA
Phone: +1 203 592 8723
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