Industry News | 2019-08-13 06:43:28.0
Techcon today announced plans to exhibit at NEPCON Asia, scheduled to take place Aug 28-30, 2019 at the Shenzhen Convention and Exhibition Center. The company will showcase its TS8100 Series Progressive Cavity Pump, TS5000DMP-DCX Auger Valve, Smart Valve Controller Series and TSR2000 Smart Dispensing Robots in Booth 1E25. Additionally, attendees will be the first to preview the new Techcon Jet Valve and Controller, scheduled to launch later this year.
Industry News | 2016-03-24 21:18:44.0
Techcon Systems will exhibit in Booth #B-1E52 at NEPCON China, scheduled to take place April 26-28, 2016 at the Shanghai World EXPO Exhibition & Convention Center. Company representatives will debut the new TS9300HM Hot Melt Jet Valve at the show and showcase its lineup of industry-leading valves.
Industry News | 2012-06-28 15:51:15.0
FCT Assembly announces that it is employing student interns from various universities in Northern Colorado to assist the company with some summer projects
Industry News | 2012-11-06 11:22:15.0
Dispensing and MID (Molded Interconnected Devices) technologies are developing rapidly. Current technology drivers are LED and communication products. On September 28th, Essemtec’s technology day focused on new developments and future challenges. The event was free of charge for all participants.
Industry News | 2012-06-26 14:04:28.0
Techcon Systems today announced the addition of 32-pitch TS7000 model to the TS7000 Valve Series.
Industry News | 2017-06-25 20:33:39.0
SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.
Industry News | 2016-03-11 00:15:11.0
SHENMAO Solder Preforms offer accurate solder deposition for various soldering processes. Reel packaged Solder Preforms provide opportunity for automation and efficient application to supplement solder when insufficient quantity solder paste is provided by design.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2018-02-27 20:43:05.0
Juki Automation Systems(JAS), Inc., a world-leading provider of automated assembly products and systems and part of Juki Automation Systems Corporation, announces that it has been awarded a 2018 NPI Award in the category of Screen / Stencil Printing for its new G-Titan Screen Printer. The award was presented to the company during a Tuesday, Feb. 27, 2018 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2023-10-09 09:21:57.0
Indium Corporation is proud to count three of its experts amongst the presenters participating in the technical program at the upcoming IMAPS International Symposium on Microelectronics, October 3-5 in San Diego, California, U.S.
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