Industry News: pcb heat dissipation options simon (Page 1 of 2)

Visit the SMTA Capital Chapter’s Expo and Tech Forum on August 23, 2012

Industry News | 2012-07-23 18:32:34.0

The SMTA Capital Chapter is pleased to invite you to the upcoming Capital Expo and Tech Form on August 23, 2012 from 9:00 am until 3:00 pm at Johns Hopkins Applied Physics Lab.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter Invites You to Attend Its Annual Expo and Tech Forum on August 23, 2012

Industry News | 2012-08-09 18:20:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter’s Expo and Tech Forum to be Held on August 23, 2012

Industry News | 2012-07-27 18:22:12.0

- The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.

Surface Mount Technology Association (SMTA)

Surface Mount Techniques (SMT) announces stencil/screen printers specifically designed for thermal grease applications

Industry News | 2010-08-27 15:08:50.0

Highly concentrated heat sources found in ever shrinking electronic designs have increased the demand for better heat dissipation. SMT has introduced several machines that accommodate larger, odd shaped substrates. The machines offer the same speed, precision, and repeatability found on SMT’s solder paste printers. This allows heat sink manufacturers to benefit from using proven, cost effective screen print technology

Surface Mount Techniques

Yash Sutariya to Present at IPC Technology Interchange on Thermal Management: Getting the Heat Out

Industry News | 2010-09-30 17:36:09.0

Presentation entitled "Thermal Management in End Applications: Dissipating the Heat Away from the Base of LEDs" to address material specifications for Metal Core / Aluminum PCBs for LED Applications.

Saturn Electronics Corporation

FINETECH to Present Three World Premieres at Productronica 2007 Tradeshow

Industry News | 2007-11-27 12:21:58.0

At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present three brand new product solutions.

Finetech

FINETECH to present three world premieres at Productronica 2007 tradeshow

Industry News | 2007-10-30 00:50:36.0

At the Productronica 2007 tradeshow in Munich, FINETECH, long-time specialist in rework and micro assembly, will present three brand new product solutions.

Finetech

Why do you need Stiffeners on Flex PCB?

Industry News | 2019-11-05 22:16:43.0

Flex PCBs are thin, light weight and easy bending, this gives much difficulty in the process of component assembly. Stiffeners are used to reinforce those areas where components will be assembled. There are many different material can be used as stiffeners, like polyimide, kapton, FR-4, Aluminium, etc, designer need to select the right material based on their thickness and characteristics.

Headpcb

What is the Advantages of Rigid-Flex PCB?

Industry News | 2019-11-05 22:19:42.0

WHAT IS RIGID-FLEX PCB? Rigid-flex PCB is a printed circuit consisting of both flexible circuit and rigid circuit. This combination is ideal for exploiting the benefits of both flexible and rigid circuits - the rigid circuits can carry all or the bulk of the components, with the flexible sections acting as interconnections between the rigid sections. Most rigid-flex circuit boards consist of multiple layers of flexible circuit substrates attached to rigid boards externally and/or internally. The flexible substrates are designed to be in a constant state of flex, and are usually formed in a flexed curve during manufacturing or installation. This is dependent upon the design of the application.

Headpcb

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

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